Hot Deformation Behavior and Microstructure Evolution of a Graphene/Copper Composite

被引：0

作者：

Li, Tiejun ^{[1
]}

Lu, Ruiyu ^{[1
]}

Cao, Yuankui ^{[1
]}

Liu, Bicheng ^{[1
]}

Fu, Ao ^{[1
]}

Liu, Bin ^{[1
]}

机构：

[1] Cent South Univ, State Key Lab Powder Met, Changsha 410083, Peoples R China

来源：

MATERIALS | 2024年 / 17卷 / 16期

关键词：

graphene/copper composite; hot deformation behavior; dynamic recrystallization; microstructure; PROCESSING MAPS; FLOW;

D O I：

10.3390/ma17164010

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Graphene/copper composites are promising in electronic and energy fields due to their superior conductivity, but microstructure control during thermal mechanical processing (TMP) remains a crucial issue for the manufacturing of high-performance graphene/copper composites. In this study, the hot deformation behavior of graphene/copper composites was investigated by isothermal compression tests at deformation temperatures of 700 similar to 850 degrees C and strain rates of 0.01 similar to 10 s(-1), and a constitutive equation based on the Arrhenius model and hot processing map was established. Results demonstrate that the deformation mechanism of the graphene/copper composites mainly involves dynamic recrystallization (DRX), and such DRX-mediated deformation behavior can be accurately described by the established Arrhenius model. In addition, it was found that the strain rate has a stronger impact on the DRX grain size than the deformation temperature. The optimum deformation temperature and strain rate were determined to be 800 degrees C and 1 s(-1), respectively, with which a uniform microstructure with fine grains can be obtained.

引用

页数：12