CuO nanoparticles embedded in laser-induced graphene for flexible planar micro-supercapacitors

被引:1
|
作者
Li, Jiaying [1 ]
Guo, Shijie [1 ]
Chen, Kunli [1 ]
Zhao, Man [1 ]
Wu, Weixin [3 ]
Xia, Xiaojuan [1 ]
Zhao, Jiang [1 ,2 ]
机构
[1] Nanjing Univ Posts & Telecommun, Coll Integrated Circuit Sci & Engn, Nanjing 210023, Peoples R China
[2] Nanjing Univ Posts & Telecommun, Nantong Inst, Nantong 226006, Peoples R China
[3] Chongqing Acad Metrol & Qual Inspect, Mech Metering & Checking Res Ctr, Chongqing 401121, Peoples R China
关键词
Flexible; Laser-induced graphene; CuO; Planar; Micro-supercapacitors; OXIDE;
D O I
10.1016/j.surfin.2024.104968
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Utilizing predefined electrode geometries, laser direct writing technology is employed to intricately inscribe flexible polyimide (PI) films, thereby inducing porous graphene patterned electrodes for flexible planar microsupercapacitors (MSCs), which greatly facilitates the integration of MSCs into functional devices for power supply. Nevertheless, prevailing challenges confront current flexible MSCs relying on laser-induced graphene (LIG), including the constrained electrochemical functionality of pure LIG electrodes and the uneven incorporation of heterogeneous constituents within LIG electrodes. In light of these challenges, this study delves into the fundamental mechanism underlying the formation of polyimide (PI) films and introduces an innovative approach to uniformly integrate CuO nanoparticles into the poly (acrylic acid) (PAA) precursor solution. The subsequent imidization process culminates in the synthesis of a CuO-embedded PI film. The research progresses to the fabrication of shape-controllable CuO/LIG patterned electrodes utilizing a precision laser direct writing technique, and the subsequent construction of flexible planar MSCs. Harnessing the synergistic interactions between the dual components within the electrode, the resulting MSC possesses an impressive areal capacitance of 6.45 mF center dot cm-2,-2 , coupled with an energy density of 0.896 mWh center dot cm-2-2 and a power density of 0.081 mW center dot cm-2,-2 , thus illustrating the potential of this innovative material integration for high-performance flexible energy storage implementations.
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页数:9
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