Influence of elasto-plastic behavior of thin films on circular buckling structures

被引：1

作者：

Meng, K. ^{[1
]}

Parry, G. ^{[1
]}

Hurier, M. A. ^{[2
]}

Tromas, C. ^{[2
]}

Coupeau, C. ^{[2
]}

机构：

[1] Univ Grenoble Alpes, SIMaP, CNRS, Grenoble INP, F-38000 Grenoble, France

[2] Univ Poitiers, Inst Pprime, CNRS, UPR 3346,ISAE,ENSMA, F-86000 Poitiers, France

来源：

INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES | 2024年 / 304卷

关键词：

Circular blister; Thin film; Plastic strain; Nanoindentation; FEM simulation; Buckles; STRAIGHT-SIDED BUCKLES; TELEPHONE CORD BUCKLES; MODULUS MISMATCH; YOUNGS MODULUS; DELAMINATION; SUBSTRATE; STRESS; TOUGHNESS; ADHESION; GROWTH;

D O I：

10.1016/j.ijsolstr.2024.113032

中图分类号：

O3 [力学];

学科分类号：

08 ; 0801 ;

摘要：

We report on circular buckles experimentally observed by optical and atomic force microscopy on gold ductile thin films deposited by physical vapor deposition on silicon wafers. It is shown that, whatever the radius blister dimensions, their maximum deflections are higher than those expected by the elastic theory. It suggests that plastic events may take place in the film, impacting on the blister morphology as a result. Based on nanoindentation experiments carried out on our gold films, a proper plastic hardening law has been determined by calculations using the finite elements method. The influence of this elasto-plastic behavior on the buckled circular profiles has been then numerically studied, compared to the experimental observations and discussed.

引用

页数：11

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