Nanoparticle-reinforced solder alloys: A comprehensive review of recent formulation properties, and mechanical performance

被引：0
|
作者：
Yahaya, Muhamad Zamri [1 ]
Azmi, Ezzatul Farhain [1 ,2 ]
Salleh, Nor Azmira [1 ]
Saad, Abdullah Aziz [2 ]
Wang, Dawei [3 ]
Kheawhom, Soorathep [4 ]
Alshoaibi, Adil [5 ]
Mohamad, Ahmad Azmin [1 ]
机构：
[1] Univ Sains Malaysia, Sch Mat & Mineral Resources Engn, Energy Mat Res Grp EMRG, Nibong Tebal 14300, Pulau Pinang, Malaysia
[2] Univ Sains Malaysia, Sch Mech Engn, Nibong Tebal 14300, Pulau Pinang, Malaysia
[3] Harbin Inst Technol, Sch Instrumentat Sci & Engn, Harbin 150080, Peoples R China
[4] Chulalongkorn Univ, Fac Engn, Dept Chem Engn, Bangkok 10330, Thailand
[5] King Faisal Univ, Coll Sci, Dept Phys, POB 400, Al Hufuf 31982, Saudi Arabia
来源：
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T | 2024年 / 32卷
关键词：
Nanoparticles; Lead-free solders; Characterization; Mechanical properties; AG-CU SOLDER; LEAD-FREE SOLDER; INTERFACIAL INTERMETALLIC GROWTH; COATED CARBON NANOTUBES; IN-SITU SYNTHESIS; TIO2; NANOPARTICLES; COMPOSITE SOLDER; SHEAR-STRENGTH; MICROSTRUCTURAL EVOLUTION; TENSILE CHARACTERISTICS;
D O I：
10.1016/j.jmrt.2024.08.166
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
This review presents a comprehensive analysis of the recent formulation of nanoparticle-reinforced solder alloys, focusing on their main properties and improvements in mechanical performance. The introduction provides an overview of solder alloys and the concept of formulating nanoparticle-reinforced solder alloys. The discussion systematically reviews the importance of various properties and critically evaluates the findings from the literature. The review compares and synthesizes the outcomes and insights regarding the impact of nanoparticle addition on the properties and performance of the resulting composite solder alloys. The aim is to identify recent trends, scientific challenges, limitations, and potential breakthroughs in the current formulation of nanoparticlereinforced solder alloys. The key value of this review lies in the compilation of the latest reports and technical setups, along with the authors' critical analysis and perceptions. This review provides an in-depth understanding and guidance for formulating novel and high-performance nanoparticle-reinforced solder alloys, making it a valuable resource for researchers and engineers in the field of advanced soldering materials.
引用
收藏
页码：3682 / 3707
页数：26
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