MITIGATION OF FLOW AND THERMAL NON-UNIFORMITY IN MEMS DEVICES: NUMERICAL INVESTIGATION

被引：0

作者：

Lodhi, Mangal Singh ^{[1
]}

Sheorey, Tanuja ^{[1
]}

Dutta, Goutam ^{[2
]}

机构：

[1] PDPM IIITDM, Discipline Mech Engn, Jabalpur 482005, MP, India

[2] IIT, Dept Mech Engn, Jammu 181221, Jammu & Kashmir, India

来源：

PROCEEDINGS OF THE 25TH NATIONAL AND 3RD INTERNATIONAL ISHMT-ASTFE HEAT AND MASS TRANSFER CONFERENCE, IHMTC 2019 | 2019年

关键词：

Microchannel heat sink; MEMS Devices; Non-uniformity; Processor chip cooling; PERFORMANCE; MALDISTRIBUTION;

D O I：

暂无

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

The present research article focuses on the problem of flow and thermal non-uniformity in a microchannel heat sink (MCHS). A concept of variable size approach is employed to mitigate flow and thermal non-uniformity in I-type MCHS. The heat dissipation requirement of an electronic chip of 8th Generation Intel Core i9 - 8950K processor of 10 mm x 10 mm size is considered in the present study. It is observed that proposed design improves flow uniformity by 91.1% and thermal uniformity improves by 70%. It is also observed that proposed design decreases maximum temperature of chip surface about 3.93 degrees C.

引用

页数：6

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