Thin-film lithium niobate PICs: advancements and potential applications in telecom and beyond

被引：0
|
作者：
Sattari, H. [1 ]
Prieto, I [1 ]
Zarebidaki, H. [1 ]
Leo, J. [1 ]
Choong, G. [1 ]
Arefi, F. [1 ]
Orvietani, M. [1 ]
Della Torre, A. [1 ]
Mettraux, A. [1 ]
Dubois, F. [1 ]
Herle, D. [1 ]
Petremand, Y. [1 ]
Palmieri, M. [1 ]
Dubochet, O. [1 ]
Despont, M. [1 ]
机构：
[1] Swiss Ctr Elect & Microtechnol CSEM, Neuchatel, Switzerland
来源：
INTEGRATED PHOTONICS PLATFORMS III | 2024年 / 13012卷
关键词：
Thin-film lithium niobate; LNOI; PIC platform; process design kit; open-access; telecommunication; monolithic; heterogeneous; GENERATION;
D O I：
10.1117/12.3026042
中图分类号：
O43 [光学];
学科分类号：
070207 ; 0803 ;
摘要：
The emergent thin-film lithium niobate on insulator (TFLN or LNOI) photonic integrated circuits (PICs) offer significant advantages in various applications due to their unique properties. This paper briefly explores recent advancements in TFLN PIC developments and their broad applications, emphasizing transformative capabilities in telecommunications and beyond. We highlight CSEM's pioneering initiative in establishing the first open access foundry for this technology, addressing challenges associated with limited access to manufacturing facilities and process design kits (PDK).
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页数：4
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