Space-Confined Growth for Thickness-Controlled Cs3Bi2I9 Perovskite Single Crystal Wafers for X-Ray Detectors

被引:0
|
作者
Yang, Manman [1 ,2 ]
Wu, Xiaoling [1 ,2 ]
Li, Anfeng [1 ,2 ]
Hao, Xia [1 ,2 ,3 ]
Wu, Lili [1 ,2 ,3 ]
Tian, Haibo [4 ]
Yang, Dingyu [4 ]
Zhang, Jingquan [1 ,2 ,3 ]
机构
[1] Sichuan Univ, Coll Mat Sci & Engn, Chengdu 610064, Peoples R China
[2] Sichuan Univ, Inst New Energy & Low carbon Technol, Chengdu 610064, Peoples R China
[3] Minist Educ, Engn Res Ctr Alternat Energy Mat & Devices, Chengdu 610065, Peoples R China
[4] Chengdu Univ Informat Technol, Coll Optoelect Technol, Chengdu 610225, Peoples R China
关键词
Cs3Bi2I9; finite element analysis; single crystal wafer; space-confined growth; X-ray detector; SOLAR-CELLS; PHOTOCONDUCTORS;
D O I
10.1002/smll.202400763
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
The Cs3Bi2I9 single crystal, as an all-inorganic non-lead perovskite, offers advantages such as stability and environmental friendliness. Its superior photoelectric properties, attributed to the absence of grain boundary influence, make it an outstanding X-ray detection material compared to polycrystals. In addition to material properties, X-ray detector performance is affected by the thickness of the absorption layer. Addressing this, a space-confined method is proposed. The temperature field is determined through finite element simulation, effectively guiding the design of the space-confined method. Through this innovative method, a series of thickness-controlled perovskite single crystal wafers (PSCWs) are successfully prepared. Corresponding X-ray detectors are then prepared, and the impact of single crystal thickness on device performance is investigated. With an increase in single crystal thickness, a rise followed by a decline in device sensitivity is observed, reaching an optimal value at 0.7 mm thickness at 40V mm(-1) with a device performance of 11313.6 mu C Gy(-1) cm(-2). This space-confined method enables the direct growth of high-quality perovskite single crystals with specified thickness, eliminating the need for slicing or etching.
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页数:8
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