InP-based Optical Devices Integrated on Silicon Photonic Circuits

被引：0

作者：

Okimoto, Takuya ^{[1
,2
,3
]}

Fujiwara, Naoki ^{[1
,2
,3
]}

Inoue, Naoko ^{[1
,2
,3
]}

Hiratani, Takuo ^{[1
,2
,3
]}

Kikuchi, Takehiko ^{[1
,2
,3
]}

Mitarai, Takuya ^{[1
,2
,3
]}

Kurokawa, Munetaka ^{[1
,2
]}

Tanaka, Hajime ^{[1
,2
,3
]}

Fujikata, Hidenari ^{[1
,2
]}

Watanabe, Tohma ^{[1
,2
]}

Nitta, Toshiyuki ^{[1
,2
,3
]}

Nishiyama, Nobuhiko ^{[1
,3
]}

Yagi, Hideki ^{[1
,2
,3
]}

机构：

[1] PETRA, Sumitomo Edogawabashi Ekimae Bldg 7F, Tokyo 1120014, Japan

[2] Sumitomo Elect Ind Ltd, Transmiss Devices Lab, 1 Taya Cho,Sakae Ku, Yokohama, Kanagawa 2448588, Japan

[3] Tokyo Inst Technol, Dept Elect & Elect Engn, 2-12-1 O Okayama,Meguro Ku, Tokyo 1528550, Japan

来源：

2024 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION, OFC | 2024年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We review our III-V/Si hybrid integration platform using chip-on-wafer direct bonding technique and the performance of hybrid lasers with InP-based gain regions on Si photonic circuits. (c) 2024 The Authors

引用

页数：3

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