Crack-free growth of UVC LEDs on 6-inch sapphire substrates using face-to-face high-temperature annealed AlN by production scale MOCVD

被引:0
|
作者
Yoshinaga, J. [1 ]
Ikejiri, K. [1 ]
Koseki, S. [1 ]
Uesugi, K. [2 ]
Miyake, H. [2 ]
机构
[1] Taiyo Nippon Sanso Corp, Minato Ku, Tokyo 1080014, Japan
[2] Mie Univ, Grad Sch Engn, Tsu, Mie 5148507, Japan
来源
关键词
Crack-free; AlGaN; UVC LED; face-to-face annealing; AlN; MOCVD;
D O I
10.1117/12.2692614
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this study, growth of crack-free AlGaN-based UVC LEDs using face-to-face high-temperature annealed AlN templates on 6-inch sapphire substrates was investigated by production scale metal-organic chemical vapor deposition (MOCVD). The utilization of face-to-face annealed sputtered-deposited thin AlN films templates successfully mitigated wafer bowing, leading to crack-free growth. Additionally, single-peak UVC emissions were obtained in the growth of 6-inch x 7-wafers, and the in-plane uniformity of (Max - Min) / Average was approximately 1.6%. Face-to-face high-temperature annealed AlN proves to be suitable for growing large-diameter UVC LEDs wafers, paving the way for mass production.
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页数:2
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