Interfacial reaction and strengthening mechanism of thermo-compression bonding foam Ni reinforced SAC105 and SAC105-0.3Ti solder joints

The foam Ni holds great potential as a reinforcement phase, attributed to its distinctive three-dimensional (3D) continuous structure. In this study, high-strength Cu connections were produced by vacuum thermo-compression bonding using Ni foam reinforced SAC105 and SAC105-0.3Ti solders. The microstructure, interfacial morphology and shear strength of the connections with different Ni foam composite solders were systematically examined. The results demonstrate that the incorporation of Ni foam as a reinforcing phase substantially enhances the strength of SAC105 solder. The introduction of foam Ni resulted in the formation of a prismatic (Cu, Ni)6Sn5 phase in the matrix and altered the composition of the IMC layer. As the bonding time increased, (Cu, Ni)6Sn5 further grew in the matrix and formed a double interpenetration structure with the foam Ni. The IMC layer, composed of (Cu, Ni)6Sn5 and Cu3Sn, exhibited a random orientation. The Cu/SAC105-0.3Ti-Foam Ni/Cu joints bonded for 10 min exhibited the highest shear strength of 70.23 MPa. Shearing failure predominantly occurs within the soldering seam. The double interpenetration structure and the random orientation of the interfacial IMC impeded crack propagation, thereby significantly enhancing the strength of the Cu joints.