DIELECTRIC AND MECHANICAL CHARACTERISTICS OF POLYAMIDE-SILICON DIOXIDE NANOCOMPOSITES

Nanocomposites have emerged as a promising area of research in recent decades due to their ability to improve the properties of host materials. Nanocomposites for cryogenic applications have gained significant attention for their potential in high-temperature superconducting (HTS) power transmission systems. However, exposure to low temperatures has detrimental effects on the material properties of the dielectrics, limiting their applications. This necessitates the investigation of thermally stable high-quality dielectrics, which can be quantified through electrical and tensile testing in various controlled environments. This paper discusses the preparation of a polyamide (PA) / SiO2 nanocomposite through a sol-gel process. The primary focus in this project is on the baseline material characteristics at room temperature. We have performed a multitude of microscopy imaging, AC and DC dielectric tests, and tensile tests, all under a room temperature environment. The results of this research can help improve the understanding of these composites and guide our future material testing in cryogenic environments.