Enhancing the Thermal Resistance of UV-Curable Resin Using (3-Thiopropyl)polysilsesquioxane

This study delineates a methodology for the preparation of new composites based on a photocurable urethane-acrylate resin, which has been modified with (3-thiopropyl)polysilsesquioxane (SSQ-SH). The organosilicon compound combines fully enclosed cage structures and incompletely condensed silanols (a mixture of random structures) obtained through the hydrolytic condensation of (3-mercaptopropyl)trimethoxysilane. This process involves a thiol-ene "click" reaction between SSQ-SH and a commercially available resin (Ebecryl 1271 (R)) in the presence of the photoinitiator DMPA, resulting in composites with significantly changed thermal properties. Various tests were conducted, including thermogravimetric analysis (TGA), Fourier transmittance infrared spectroscopy (FT-IR), differential scanning calorimetry (Photo-DSC), and photoreological measurement mechanical property, and water contact angle (WCA) tests. The modification of resin with SSQ-SH increased the temperature of 1% and 5% mass loss compared to the reference (for 50 wt% SSQ-SH, T5% was 310.8 degrees C, an increase of 20.4 degrees C). A composition containing 50 wt% of SSQ-SH crosslinked faster than the reference resin, a phenomenon confirmed by photorheological tests. This research highlights the potential of new composite materials in coating applications across diverse industries. The modification of resin with SSQ-SH not only enhances thermal properties but also introduces a host of functional improvements, thereby elevating the performance of the resulting coatings.