A Miniaturized Electrochemical Angular Accelerometer with the Integration of Microelectrodes and Channel

This paper reports a miniaturized electrochemical angular accelerometer with the integration of planar microelectrodes and toroid channel. Specifically the proposed sensor adopted a three-layer bonding structure of glass-silicon-glass in preference to manual mechanical compression structure, which reduced the device size and simplified the assembly processes. The anodic bonding technology was used as a packaging method, which realized the chip-level package of MEMS electrochemical angular accelerometer for the first time and solved the problem of cathode outlet From the experimental results, it has the characteristics of larger measurement range (up to 3.5rad/s(2)) and lower noise level (-144dB@1Hz), which is a significant improvement compared with the previously reported counterparts. A novel approach for the production of electrochemical angular accelerometers is presented in this study, which could be utilized for rotational seismic measurement with large angle variations.