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Guest Editorial Introduction to the Special Section on the 2023 RFIC Symposium
被引:0
|作者:
Okada, Kenichi
[1
]
机构:
[1] Tokyo Inst Technol, Elect & Elect Engn, Tokyo 1528550, Japan
关键词:
Special issues and sections;
Meetings;
Radiofrequency integrated circuits;
D O I:
10.1109/JSSC.2024.3379608
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
This special section of the IEEE Journal of Solid-State Circuits presents the expanded versions of selected articles presented at the 2023 Radio Frequency Integrated Circuits Symposium (RFIC) held in San Diego, CA, USA, during June 11-13, 2023. The RFIC Symposium is the world's premier conference focused on RF and millimeter-wave (mmWave) integrated circuits and systems technology. In addition to showcasing state-of-the-art high-frequency IC design techniques, the conference has evolved to encompass a wide range of emerging technologies and applications, including wireless/wireline communication, cryogenic technology, and other innovations in RF, millimeter-wave, terahertz-wave, and analog/mixed-signal ICs. The collection of papers in this special Section reflects the diversity and multidisciplinary nature of the RFIC Symposium.
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页码:1300 / 1300
页数:1
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