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- [2] INVESTIGATION OF PERFORMANCE AND REPAIRABILITY OF ADDITIVELY PRINTED FUNCTIONAL CIRCUITS WITH WATER-BASED SILVER INK ON AN INKJET PLATFORM PROCEEDINGS OF ASME 2023 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2023, 2023,
- [3] COMPONENT ATTACH PROCESS RECIPE AND PERFORMANCE ON AEROSOL PRINTED SUSTAINABLE SILVER INK PROCEEDINGS OF ASME 2023 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2023, 2023,
- [4] Comparison of Sustainable and Non-Sustainable Ink Process-Performance Interactions for Additively Printed Circuits PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024, 2024, : 982 - 989
- [5] SURFACE-MOUNT COMPONENT ATTACHMENT ON AEROSOL JET PRINTED SUSTAINABLE WATER-BASE SILVER NANOPARTICLE INK PROCEEDINGS OF ASME 2023 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2023, 2023,