The Study on Bulging Mechanism of Plastic Packaging Materials for Electronics Materials for Electronics

Due to the character of lowly cost and large-scale automated production, plastic packaging materials are widely used in the packaging of electronics. As a common failure mode of plastic packaging materials, bulging will reduce the protective effect of plastic packaging materials on electronics, which has negative impacts on the reliability of electronics. The expansion of gas inside plastic packaging materials and the evaporation of moisture contained in plastic packaging materials are the main reasons for the bulging of plastic packaging materials. Through Differential Scanning Calorimeter (DSC) and Gas Chromatography-Mass Spectrometry (GC-MS), further research on bulging mechanism of plastic packaging materials is carried out. It is found that the curing degree of plastic packaging materials and the additives contained in plastic packaging materials are closely related to the bulging. In case 1, the DSC results show that the curing degree of the failed plastic packaging materials is significantly lower than that of the good plastic packaging materials, resulting in a decline in the mechanical strength of the failed plastic packaging materials. The gas in the inner cavity of the failed sample expands during the preheating, leading to the bulging of the failed plastic packaging materials. In case 2, the GC-MS results show that the failed plastic packaging materials contain 4-tert-butylphenyl glycidyl ether which is hygroscopic. During the wave soldering, moisture in the failed plastic packaging materials evaporates at high temperature, leading to the bulging of the failed plastic packaging materials.