Numerical simulations for microstructure evolution during metal additive manufacturing

被引:0
|
作者
Chen Z. [1 ]
Li X. [1 ]
机构
[1] Department of Engineering Mechanics, Tsinghua University, Beijing
关键词
cellular automaton; heat conduction; metal additive manufacturing; microstructure evolution; three-dimensional simulation;
D O I
10.6052/1000-0992-22-021
中图分类号
学科分类号
摘要
As an emerging manufacturing technology, metal additive manufacturing has broad application prospects in aerospace and aeronautics, transportation, and biomedical engineering. The mechanical properties and performances of materials produced through metal additive manufacturing are determined by their microstructures. It is of great importance to develop the numerical simulations for microstructure evolution during metal additive manufacturing. These simulations can guide and optimize the processing (especially the processing parameters), leading to fabricating the metallic materials with excellent properties and performances. Here, we develop a numerical method for metal additive manufacturing that integrates the heat conduction model with the cellular automaton method. This method can be used for the simulations of multilayers powder fabrication in metal additive manufacturing by utilizing the element birth and death technique and by considering both remelting and regrowth processes of grains. We use this method to predict the typical microstructures of nickel-based superalloy IN718, stainless steel 316L, and FeCoCrNiMn high-entropy alloys fabricated through metal additive manufacturing. The predictions from numerical simulations are consistent with the experimental results. Furthermore, we extend this method to simulate the three-dimensional microstructure evolution of nickel-based superalloy IN718 during metal additive manufacturing. Finally, we point out some important issues and challenges for future research on the numerical simulations for the process of metal additive manufacturing. © 2022 Chinese Academy of Mechanics. All rights reserved.
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页码:397 / 409
页数:12
相关论文
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