Research Status and Prospect of CMG Technology

被引：2
|
作者：
Ren Y. [1 ]
Zhou J. [1 ]
Li W. [1 ]
Zhou Z. [1 ]
Li C. [1 ]
机构：
[1] College of Mechanical and Vehicle Engineering, Hunan University, Changsha
来源：
Zhongguo Jixie Gongcheng/China Mechanical Engineering | 2021年 / 32卷 / 18期
关键词：
Chemo-mechanical grinding(CMG); Grinding mechanism; Hard-brittle material; Special grinding tool;
D O I：
10.3969/j.issn.1004-132X.2021.18.001
中图分类号：
学科分类号：
摘要：
At present, the CMG technology was widely applied in fields of optics and semiconductors manufacturing, because it might achieve ultra-precision, high quality and low damage processing for hard-brittle materials such as monocrystalline silicon and quartz glass through chemo-mechanical synergistic processes. Current CMG research status around material removal mechanism, grinding processes and compound processes was reviewed, and these existing problems for related researches were summarized. Factors affecting the quality and processing efficiency of CMG were discussed furtherly. The analyses show that revealing the mechanism of CMG from the perspective of solid-solid phase chemical reaction and chemo-mechanical synergistic effect is helpful to innovate feasible methods to improve the processing efficiency of this technology from the perspectives of material removal mechanism, grinding tool structure design and compound processing development. Furthermore, the probable development trend of CMG technology in the direction of diversified processing materials, more complicated structure processing, multi-energy field compound processing, and related intelligent machining databases were forecasted. © 2021, China Mechanical Engineering Magazine Office. All right reserved.
引用
收藏
页码：2143 / 2152
页数：9
相关论文
共 59 条
  • [1] YUAN Julong, ZHANG Feihu, DAI Yifan, Et al., Development Research of Science and Technologies in Ultra-precision Machining Field, Journal of Mechanical Engineering, 46, 15, pp. 161-177, (2010)
  • [2] GAO Shang, ZHU Xianglong, KANG Renke, Et al., Surface/Subsurface Damage and Material Removal Mechanism of Glass-ceramics Induced by Ultra-precision Grinding, Journal of Mechanical Engineering, 53, 7, pp. 180-188, (2017)
  • [3] HU Zhongwei, SHAO Mingjian, GUO Jianmin, Et al., Comparison of Grinding Characteristics of Different Crystal Surfaces for Sapphire, Optics and Precision Engineering, 25, 5, pp. 1250-1258, (2017)
  • [4] YAN Guanpeng, FANG Fengzhou, Fabrication of Optical Freeform Molds Using Slow Tool Servo with Wheel Normal Grinding, CIRP Annals-Manufacturing Technology, 68, pp. 341-344, (2019)
  • [5] ZHOU Libo, KAWAI S, HONDA M, Et al., Research on Chemo-mechanical-grinding(CMG) of Si Wafer:1st Report:Development of CMG Wheel, (2002)
  • [6] YIN Shaohui, OHMORI H, DAI Yutang, Et al., ELID Grinding Characteristics of Glass-ceramic Materials[J], International Journal of Machine Tools & Manufacture, 49, 3, pp. 333-338, (2009)
  • [7] WANG Xu, ZHAO Ping, LYU Binghai, Et al., Research Status of Ultra-precision Machining Technologies for Working Surface of Rolling Bearings, China Mechanical Engineering, 30, 11, pp. 1301-1309, (2019)
  • [8] ZHANG Feihu, MENG Binbin, LI Chen, Et al., Material Removal Mechanism and Grinding Force Modelling of Ultrasonic Vibration Assisted Grinding for SiC Ceramics[J], Ceramics International, 43, 3, pp. 2981-2993, (2017)
  • [9] GUO Bing, ZHAO Qingliang, Ultrasonic Vibration Assisted Grinding of Hard and Brittle Linear Micro-structured Surfaces, Precision Engineering, 48, pp. 98-106, (2016)
  • [10] ZHENG Kan, LIAO Wenhe, SUN Lianjun, Et al., Investigation on Grinding Temperature in Ultrasonic Vibration-assisted Grinding of Zirconia Ceramics, Machining Science and Technology, 23, 4, pp. 612-628, (2019)
123456