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- [1] A triple-layer structure flexible sensor based on nano-sintered silver for power electronics with high temperature resistance and high thermal conductivityCHEMICAL ENGINEERING JOURNAL, 2022, 432Zhou, Haoran论文数: 0 引用数: 0 h-index: 0机构: Harbin Univ Sci & Technol, Sch Mat Sci & Engn, Harbin, Peoples R China Harbin Univ Sci & Technol, Sch Mat Sci & Engn, Harbin, Peoples R ChinaGuo, Ke论文数: 0 引用数: 0 h-index: 0机构: Harbin Univ Sci & Technol, Sch Mat Sci & Engn, Harbin, Peoples R China Harbin Univ Sci & Technol, Sch Mat Sci & Engn, Harbin, Peoples R ChinaMa, Shengqi论文数: 0 引用数: 0 h-index: 0机构: Jilin Univ, Coll Chem, Key Lab High Performance Plast, Minist Educ,Natl & Local Joint Engn Lab Synth Tec, Changchun 130012, Peoples R China Harbin Univ Sci & Technol, Sch Mat Sci & Engn, Harbin, Peoples R ChinaWang, Chengyang论文数: 0 引用数: 0 h-index: 0机构: Jilin Univ, Coll Chem, Key Lab High Performance Plast, Minist Educ,Natl & Local Joint Engn Lab Synth Tec, Changchun 130012, Peoples R China Harbin Univ Sci & Technol, Sch Mat Sci & Engn, Harbin, Peoples R ChinaFan, Xupeng论文数: 0 引用数: 0 h-index: 0机构: Heilongjiang Acad Sci, Inst Petro Chem, Harbin 150040, Peoples R China Harbin Univ Sci & Technol, Sch Mat Sci & Engn, Harbin, Peoples R ChinaJia, Tingting论文数: 0 引用数: 0 h-index: 0机构: Harbin Univ Sci & Technol, Sch Mat Sci & Engn, Harbin, Peoples R China Harbin Univ Sci & Technol, Sch Mat Sci & Engn, Harbin, Peoples R ChinaZhang, Zhennan论文数: 0 引用数: 0 h-index: 0机构: Harbin Univ Sci & Technol, Sch Mat Sci & Engn, Harbin, Peoples R China Harbin Univ Sci & Technol, Sch Mat Sci & Engn, Harbin, Peoples R ChinaXu, Huikang论文数: 0 引用数: 0 h-index: 0机构: Heilongjiang Acad Sci, Inst Petro Chem, Harbin 150040, Peoples R China Harbin Univ Sci & Technol, Sch Mat Sci & Engn, Harbin, Peoples R ChinaXing, Hao论文数: 0 引用数: 0 h-index: 0机构: Harbin Univ Sci & Technol, Sch Mat Sci & Engn, Harbin, Peoples R China Harbin Univ Sci & Technol, Sch Mat Sci & Engn, Harbin, Peoples R ChinaWang, Dezhi论文数: 0 引用数: 0 h-index: 0机构: Heilongjiang Acad Sci, Inst Petro Chem, Harbin 150040, Peoples R China Harbin Univ Sci & Technol, Sch Mat Sci & Engn, Harbin, Peoples R ChinaLiu, Changwei论文数: 0 引用数: 0 h-index: 0机构: Heilongjiang Acad Sci, Inst Petro Chem, Harbin 150040, Peoples R China Harbin Univ Sci & Technol, Sch Mat Sci & Engn, Harbin, Peoples R China
- [2] Thermal Resistance and Luminescence Performance of Nano-Silver Sintered Interface in High-Power LEDACTA OPTICA SINICA, 2023, 43 (02)Liang Renli论文数: 0 引用数: 0 h-index: 0机构: Univ Elect Sci & Technol China, Shenzhen Inst Adv Study, Shenzhen 518110, Guangdong, Peoples R China Shenzhen Inst Informat Technol, Informat Technol Res Inst, Shenzhen 518172, Guangdong, Peoples R China Univ Elect Sci & Technol China, Shenzhen Inst Adv Study, Shenzhen 518110, Guangdong, Peoples R ChinaLiu Jiaxin论文数: 0 引用数: 0 h-index: 0机构: Huazhong Univ Sci & Technol, Sch Mech Sci & Engn, Wuhan 430074, Hubei, Peoples R China Univ Elect Sci & Technol China, Shenzhen Inst Adv Study, Shenzhen 518110, Guangdong, Peoples R ChinaZhao Jiuzhou论文数: 0 引用数: 0 h-index: 0机构: Huazhong Univ Sci & Technol, Sch Aerosp Engn, Wuhan 430074, Hubei, Peoples R China Univ Elect Sci & Technol China, Shenzhen Inst Adv Study, Shenzhen 518110, Guangdong, Peoples R ChinaPeng Yang论文数: 0 引用数: 0 h-index: 0机构: Huazhong Univ Sci & Technol, Sch Aerosp Engn, Wuhan 430074, Hubei, Peoples R China Univ Elect Sci & Technol China, Shenzhen Inst Adv Study, Shenzhen 518110, Guangdong, Peoples R ChinaWang Xinzhong论文数: 0 引用数: 0 h-index: 0机构: Shenzhen Inst Informat Technol, Informat Technol Res Inst, Shenzhen 518172, Guangdong, Peoples R China Univ Elect Sci & Technol China, Shenzhen Inst Adv Study, Shenzhen 518110, Guangdong, Peoples R ChinaYang Jun论文数: 0 引用数: 0 h-index: 0机构: Univ Elect Sci & Technol China, Shenzhen Inst Adv Study, Shenzhen 518110, Guangdong, Peoples R China Univ Elect Sci & Technol China, Shenzhen Inst Adv Study, Shenzhen 518110, Guangdong, Peoples R China
- [3] Thermal conductivity simulation of sintered nano-silver for high-power electronic devices<bold> </bold>2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2024,Long, Xu论文数: 0 引用数: 0 h-index: 0机构: Northwestern Polytech Univ Shenzhen, Res & Dev Inst, Shenzhen, Peoples R China Northwestern Polytech Univ Shenzhen, Res & Dev Inst, Shenzhen, Peoples R ChinaZhao, Xianyi论文数: 0 引用数: 0 h-index: 0机构: Northwestern Polytech Univ, Sch Mech Civil Engn & Architecture, Xian, Peoples R China Northwestern Polytech Univ Shenzhen, Res & Dev Inst, Shenzhen, Peoples R ChinaShi, Hongbin论文数: 0 引用数: 0 h-index: 0机构: Huawei Technol Co Ltd, Xian, Peoples R China Northwestern Polytech Univ Shenzhen, Res & Dev Inst, Shenzhen, Peoples R ChinaChang, Chao论文数: 0 引用数: 0 h-index: 0机构: Taiyuan Univ Sci & Technol, Sch Appl Sci, Taiyuan, Peoples R China Northwestern Polytech Univ Shenzhen, Res & Dev Inst, Shenzhen, Peoples R ChinaWang, Zhi论文数: 0 引用数: 0 h-index: 0机构: Yongguang Elect Co Ltd, China Zhenhua Grp, Guiyang, Peoples R China Northwestern Polytech Univ Shenzhen, Res & Dev Inst, Shenzhen, Peoples R ChinaSu, Yutai论文数: 0 引用数: 0 h-index: 0机构: Northwestern Polytech Univ, Sch Mech Civil Engn & Architecture, Xian, Peoples R China Northwestern Polytech Univ Shenzhen, Res & Dev Inst, Shenzhen, Peoples R China
- [4] The mechanism of pore segregation in the sintered nano Ag for high temperature power electronics applicationsMATERIALS LETTERS, 2018, 228 : 168 - 171Zhao, Zhenyu论文数: 0 引用数: 0 h-index: 0机构: Tsinghua Univ, Dept Mech Engn, State Key Lab Tribol, Beijing 100084, Peoples R China Tsinghua Univ, Dept Mech Engn, State Key Lab Tribol, Beijing 100084, Peoples R ChinaZou, Guisheng论文数: 0 引用数: 0 h-index: 0机构: Tsinghua Univ, Dept Mech Engn, State Key Lab Tribol, Beijing 100084, Peoples R China Tsinghua Univ, Dept Mech Engn, State Key Lab Tribol, Beijing 100084, Peoples R ChinaZhang, Hongqiang论文数: 0 引用数: 0 h-index: 0机构: Tsinghua Univ, Dept Mech Engn, State Key Lab Tribol, Beijing 100084, Peoples R China Tsinghua Univ, Dept Mech Engn, State Key Lab Tribol, Beijing 100084, Peoples R ChinaRen, Hui论文数: 0 引用数: 0 h-index: 0机构: Tsinghua Univ, Dept Mech Engn, State Key Lab Tribol, Beijing 100084, Peoples R China Tsinghua Univ, Dept Mech Engn, State Key Lab Tribol, Beijing 100084, Peoples R ChinaLiu, Lei论文数: 0 引用数: 0 h-index: 0机构: Tsinghua Univ, Dept Mech Engn, State Key Lab Tribol, Beijing 100084, Peoples R China Tsinghua Univ, Dept Mech Engn, State Key Lab Tribol, Beijing 100084, Peoples R ChinaZhou, Y. Norman论文数: 0 引用数: 0 h-index: 0机构: Tsinghua Univ, Dept Mech Engn, State Key Lab Tribol, Beijing 100084, Peoples R China Univ Waterloo, Dept Mech & Mechatron Engn, Waterloo, ON N2L 3G1, Canada Tsinghua Univ, Dept Mech Engn, State Key Lab Tribol, Beijing 100084, Peoples R China
- [5] Nano-Silver Ink of High Conductivity and Low Sintering Temperature for Paper ElectronicsNanoscale Research Letters, 2019, 14Lixin Mo论文数: 0 引用数: 0 h-index: 0机构: Beijing Institute of Graphic Communication,Beijing Engineering Research Center of Printed ElectronicsZhenxin Guo论文数: 0 引用数: 0 h-index: 0机构: Beijing Institute of Graphic Communication,Beijing Engineering Research Center of Printed ElectronicsZhenguo Wang论文数: 0 引用数: 0 h-index: 0机构: Beijing Institute of Graphic Communication,Beijing Engineering Research Center of Printed ElectronicsLi Yang论文数: 0 引用数: 0 h-index: 0机构: Beijing Institute of Graphic Communication,Beijing Engineering Research Center of Printed ElectronicsYi Fang论文数: 0 引用数: 0 h-index: 0机构: Beijing Institute of Graphic Communication,Beijing Engineering Research Center of Printed ElectronicsZhiqing Xin论文数: 0 引用数: 0 h-index: 0机构: Beijing Institute of Graphic Communication,Beijing Engineering Research Center of Printed ElectronicsXiu Li论文数: 0 引用数: 0 h-index: 0机构: Beijing Institute of Graphic Communication,Beijing Engineering Research Center of Printed ElectronicsYinjie Chen论文数: 0 引用数: 0 h-index: 0机构: Beijing Institute of Graphic Communication,Beijing Engineering Research Center of Printed ElectronicsMeijuan Cao论文数: 0 引用数: 0 h-index: 0机构: Beijing Institute of Graphic Communication,Beijing Engineering Research Center of Printed ElectronicsQingqing Zhang论文数: 0 引用数: 0 h-index: 0机构: Beijing Institute of Graphic Communication,Beijing Engineering Research Center of Printed ElectronicsLuhai Li论文数: 0 引用数: 0 h-index: 0机构: Beijing Institute of Graphic Communication,Beijing Engineering Research Center of Printed Electronics
- [6] Nano-Silver Ink of High Conductivity and Low Sintering Temperature for Paper ElectronicsNANOSCALE RESEARCH LETTERS, 2019, 14 (1):Mo, Lixin论文数: 0 引用数: 0 h-index: 0机构: RISE Bioecon, Res Inst Sweden RISE, Drottning Kristinas Vag 61, S-11428 Stockholm, Sweden RISE Bioecon, Res Inst Sweden RISE, Drottning Kristinas Vag 61, S-11428 Stockholm, SwedenGuo, Zhenxin论文数: 0 引用数: 0 h-index: 0机构: RISE Bioecon, Res Inst Sweden RISE, Drottning Kristinas Vag 61, S-11428 Stockholm, Sweden RISE Bioecon, Res Inst Sweden RISE, Drottning Kristinas Vag 61, S-11428 Stockholm, SwedenWang, Zhenguo论文数: 0 引用数: 0 h-index: 0机构: RISE Bioecon, Res Inst Sweden RISE, Drottning Kristinas Vag 61, S-11428 Stockholm, Sweden RISE Bioecon, Res Inst Sweden RISE, Drottning Kristinas Vag 61, S-11428 Stockholm, SwedenYang, Li论文数: 0 引用数: 0 h-index: 0机构: Beijing Inst Graph Commun, Beijing Engn Res Ctr Printed Elect, Beijing 102600, Peoples R China RISE Bioecon, Res Inst Sweden RISE, Drottning Kristinas Vag 61, S-11428 Stockholm, SwedenFang, Yi论文数: 0 引用数: 0 h-index: 0机构: RISE Bioecon, Res Inst Sweden RISE, Drottning Kristinas Vag 61, S-11428 Stockholm, Sweden RISE Bioecon, Res Inst Sweden RISE, Drottning Kristinas Vag 61, S-11428 Stockholm, SwedenXin, Zhiqing论文数: 0 引用数: 0 h-index: 0机构: RISE Bioecon, Res Inst Sweden RISE, Drottning Kristinas Vag 61, S-11428 Stockholm, Sweden RISE Bioecon, Res Inst Sweden RISE, Drottning Kristinas Vag 61, S-11428 Stockholm, SwedenLi, Xiu论文数: 0 引用数: 0 h-index: 0机构: RISE Bioecon, Res Inst Sweden RISE, Drottning Kristinas Vag 61, S-11428 Stockholm, Sweden RISE Bioecon, Res Inst Sweden RISE, Drottning Kristinas Vag 61, S-11428 Stockholm, SwedenChen, Yinjie论文数: 0 引用数: 0 h-index: 0机构: RISE Bioecon, Res Inst Sweden RISE, Drottning Kristinas Vag 61, S-11428 Stockholm, Sweden RISE Bioecon, Res Inst Sweden RISE, Drottning Kristinas Vag 61, S-11428 Stockholm, SwedenCao, Meijuan论文数: 0 引用数: 0 h-index: 0机构: RISE Bioecon, Res Inst Sweden RISE, Drottning Kristinas Vag 61, S-11428 Stockholm, Sweden RISE Bioecon, Res Inst Sweden RISE, Drottning Kristinas Vag 61, S-11428 Stockholm, SwedenZhang, Qingqing论文数: 0 引用数: 0 h-index: 0机构: RISE Bioecon, Res Inst Sweden RISE, Drottning Kristinas Vag 61, S-11428 Stockholm, Sweden RISE Bioecon, Res Inst Sweden RISE, Drottning Kristinas Vag 61, S-11428 Stockholm, SwedenLi, Luhai论文数: 0 引用数: 0 h-index: 0机构: RISE Bioecon, Res Inst Sweden RISE, Drottning Kristinas Vag 61, S-11428 Stockholm, Sweden RISE Bioecon, Res Inst Sweden RISE, Drottning Kristinas Vag 61, S-11428 Stockholm, Sweden
- [7] Thermal interface material with graphene enhanced sintered copper for high temperature power electronicsNANOTECHNOLOGY, 2021, 32 (31)Deng, Shaojia论文数: 0 引用数: 0 h-index: 0机构: Guangdong Univ Technol, Sch Electromech Engn, State Key Lab Precis Elect Mfg Technol & Equipmen, Guangzhou 510006, Peoples R China Guangdong Univ Technol, Sch Electromech Engn, State Key Lab Precis Elect Mfg Technol & Equipmen, Guangzhou 510006, Peoples R ChinaZhang, Xin论文数: 0 引用数: 0 h-index: 0机构: Guangdong Univ Technol, Sch Electromech Engn, State Key Lab Precis Elect Mfg Technol & Equipmen, Guangzhou 510006, Peoples R China Guangdong Univ Technol, Sch Electromech Engn, State Key Lab Precis Elect Mfg Technol & Equipmen, Guangzhou 510006, Peoples R ChinaXiao, Guowei David论文数: 0 引用数: 0 h-index: 0机构: APT Elect Co Ltd, 33 South Huan Shi Rd, Guangzhou 511458, Peoples R China Guangdong Univ Technol, Sch Electromech Engn, State Key Lab Precis Elect Mfg Technol & Equipmen, Guangzhou 510006, Peoples R ChinaZhang, Kai论文数: 0 引用数: 0 h-index: 0机构: Guangdong Univ Technol, Sch Electromech Engn, State Key Lab Precis Elect Mfg Technol & Equipmen, Guangzhou 510006, Peoples R China Guangdong Univ Technol, Sch Electromech Engn, State Key Lab Precis Elect Mfg Technol & Equipmen, Guangzhou 510006, Peoples R ChinaHe, Xiaowu论文数: 0 引用数: 0 h-index: 0机构: Guangdong Univ Technol, Sch Electromech Engn, State Key Lab Precis Elect Mfg Technol & Equipmen, Guangzhou 510006, Peoples R China Guangdong Univ Technol, Sch Electromech Engn, State Key Lab Precis Elect Mfg Technol & Equipmen, Guangzhou 510006, Peoples R ChinaXin, Shihan论文数: 0 引用数: 0 h-index: 0机构: Guangdong Univ Technol, Sch Electromech Engn, State Key Lab Precis Elect Mfg Technol & Equipmen, Guangzhou 510006, Peoples R China Guangdong Univ Technol, Sch Electromech Engn, State Key Lab Precis Elect Mfg Technol & Equipmen, Guangzhou 510006, Peoples R ChinaLiu, Xinlu论文数: 0 引用数: 0 h-index: 0机构: Guangdong Univ Technol, Sch Electromech Engn, State Key Lab Precis Elect Mfg Technol & Equipmen, Guangzhou 510006, Peoples R China Guangdong Univ Technol, Sch Electromech Engn, State Key Lab Precis Elect Mfg Technol & Equipmen, Guangzhou 510006, Peoples R ChinaZhong, Anhui论文数: 0 引用数: 0 h-index: 0机构: Guangdong Univ Technol, Sch Electromech Engn, State Key Lab Precis Elect Mfg Technol & Equipmen, Guangzhou 510006, Peoples R China Guangdong Univ Technol, Sch Electromech Engn, State Key Lab Precis Elect Mfg Technol & Equipmen, Guangzhou 510006, Peoples R ChinaChai, Yang论文数: 0 引用数: 0 h-index: 0机构: Hong Kong Polytech Univ, Dept Appl Phys, Hunghom, Kowloon, Hong Kong, Peoples R China Guangdong Univ Technol, Sch Electromech Engn, State Key Lab Precis Elect Mfg Technol & Equipmen, Guangzhou 510006, Peoples R China
- [8] High thermal conductivity diamond-doped silver paste for power electronics packagingMATERIALS LETTERS, 2022, 311Zhao, Peihao论文数: 0 引用数: 0 h-index: 0机构: Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300350, Peoples R China Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300350, Peoples R ChinaLi, Xin论文数: 0 引用数: 0 h-index: 0机构: Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300350, Peoples R China Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300350, Peoples R ChinaMei, Yunhui论文数: 0 引用数: 0 h-index: 0机构: Tiangong Univ, Sch Elect & Elect Engn, Tianjin 300387, Peoples R China Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300350, Peoples R ChinaLu, Guo-Quan论文数: 0 引用数: 0 h-index: 0机构: Virginia Tech, Dept Mat Sci & Engn, Blacksburg, VA 24061 USA Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300350, Peoples R China
- [9] High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packagingRESULTS IN PHYSICS, 2022, 33Fan, Jiajie论文数: 0 引用数: 0 h-index: 0机构: Fudan Univ, Acad Engn & Technol, Inst Future Lighting, Shanghai 200433, Peoples R China Fudan Univ, Shanghai Engn Technol Res Ctr SiC Power Device, Shanghai 200433, Peoples R China Fudan Univ, Acad Engn & Technol, Inst Future Lighting, Shanghai 200433, Peoples R ChinaJiang, Dawei论文数: 0 引用数: 0 h-index: 0机构: Hohai Univ, Coll Mech & Elect Engn, Changzhou 213022, Jiangsu, Peoples R China Fudan Univ, Acad Engn & Technol, Inst Future Lighting, Shanghai 200433, Peoples R ChinaZhang, Hao论文数: 0 引用数: 0 h-index: 0机构: Nanyang Technol Univ, Sch Mat Sci & Engn, Singapore 639798, Singapore Fudan Univ, Acad Engn & Technol, Inst Future Lighting, Shanghai 200433, Peoples R ChinaHu, Dong论文数: 0 引用数: 0 h-index: 0机构: Delft Univ Technol, Dept Microelect Engn, NL-2628 Delft, Netherlands Fudan Univ, Acad Engn & Technol, Inst Future Lighting, Shanghai 200433, Peoples R ChinaLiu, Xu论文数: 0 引用数: 0 h-index: 0机构: Delft Univ Technol, Dept Microelect Engn, NL-2628 Delft, Netherlands Fudan Univ, Acad Engn & Technol, Inst Future Lighting, Shanghai 200433, Peoples R ChinaFan, Xuejun论文数: 0 引用数: 0 h-index: 0机构: Lamar Univ, Dept Mech Engn, Beaumont, TX 77705 USA Fudan Univ, Acad Engn & Technol, Inst Future Lighting, Shanghai 200433, Peoples R ChinaZhang, Guoqi论文数: 0 引用数: 0 h-index: 0机构: Delft Univ Technol, Dept Microelect Engn, NL-2628 Delft, Netherlands Fudan Univ, Acad Engn & Technol, Inst Future Lighting, Shanghai 200433, Peoples R China
- [10] A High Temperature and Low Power SOI CMOS MEMS based Thermal Conductivity Gas Sensor2013 INTERNATIONAL SEMICONDUCTOR CONFERENCE (CAS), VOLS 1-2, 2013, : 51 - 54Sarfraz, Sohab论文数: 0 引用数: 0 h-index: 0机构: Univ Cambridge, Dept Mat Sci & Met, Cambridge, Cambs, England Univ Cambridge, Dept Engn, Cambridge, Cambs, England Univ Cambridge, Dept Mat Sci & Met, Cambridge, Cambs, EnglandKumar, R. Vasant论文数: 0 引用数: 0 h-index: 0机构: Univ Cambridge, Dept Mat Sci & Met, Cambridge, Cambs, England Univ Cambridge, Dept Mat Sci & Met, Cambridge, Cambs, England论文数: 引用数: h-index:机构: