Effects of rare earth Ce addition on the microstructure and shear property of Cu/In-50Ag/Cu composite solder joint

被引：0
|
作者：
Yang, Li [1 ,3 ]
Qiao, Jian [2 ]
Zhang, Yaocheng [4 ]
Gao, Huiming [5 ]
Yao, Zengjian [5 ]
Xu, Feng [4 ]
机构：
[1] School of Materials and Energy, Guangdong University of Technology, Guangdong,510006, China
[2] School of Mechanical Engineering, Soochow University, Jiangsu,215021, China
[3] School of Mechanical Engineering, Guilin University of Aerospace Technology, Guangxi,541004, China
[4] School of Automotive Engineering, Changshu Institute of Technology, Jiangsu,215500, China
[5] National Dies and Molds Quality Supervision Test Center, Jiangsu,215300, China
来源：
Microelectronics Reliability | 2021年 / 127卷
基金：
中国国家自然科学基金;
关键词：
28;
D O I：
暂无
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学科分类号：
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