Design of Ultra-Wideband Active Magnetic Field Probe for Near-Field Measurement

被引:0
|
作者
Chen Z. [1 ]
Wang Y. [1 ]
Huang P. [1 ]
Shao W. [2 ]
Ye C. [1 ]
Fang W. [2 ]
Huang Y. [2 ]
机构
[1] School of Electronic and Information Engineering, South China University of Technology, Guangzhou
[2] Electronic Produce Reliability and Environmental Testing Research Institute, The Fifth Institute of Ministry of Industry and Information Technology, Guangzhou
基金
中国国家自然科学基金;
关键词
Active magnetic field probe; Calibration factor; Differential electric field suppression capability; Frequency response; Spatial resolution; Transmission gain; Ultra-wideband;
D O I
10.12141/j.issn.1000-565X.200312
中图分类号
学科分类号
摘要
The current active probe, whose detection frequency is mainly concentrated in the low frequency band, can't meet the detection requirements of the high frequency band. Therefore, a small, high-bandwidth, non-contact active magnetic field probe was proposed. The active magnetic field probe is made of a multilayer printed circuit board (PCB). An active amplifier module and its supporting power management chip were added to the passive probe to improve the transmission gain of the ultra-wideband type probe. The probe was tested and analyzed from four aspects: frequency response, spatial resolution, calibration factor, and differential electric field suppression capability. The results show that the designed probe has a transmission gain of -20dB, a spatial resolution of 900μm, and is of good differential electric field suppression. The probe can be used for ultra-wideband PCB board and more complex integrated circuit measurements. © 2021, Editorial Department, Journal of South China University of Technology. All right reserved.
引用
收藏
页码:131 / 140
页数:9
相关论文
共 28 条
  • [1] (2019)
  • [2] SHIGETA Y, SATO N, ARAI K, Et al., High spatial resolution on-chip active magnetic field probe for IC chip-level near field measurements, Proceedings of the International Symposium on Electro-magnetic Compatibility, pp. 569-572, (2014)
  • [3] MAI-KHANH N N, IIZUKA T, YAMADA M, Et al., An integrated high-precision probe system in 0. 18μm CMOS for near-field magnetic measurements on cryptographic LSIs, IEEE Sensors, 13, 7, pp. 2675-2682, (2013)
  • [4] DHIA S B, RAMDANI M, SICARD E., Electronmagnetic compatibility of integrated circuits technique for low emission and susceptibility, (2006)
  • [5] MUROGA S, ARAI K, DHUANGANA S, Et al., 3-D magnetic-near-field scanner for IC chip-level noise coupling measurements, IEEE Transactions on Magnetics, 49, 7, pp. 3886-3889, (2013)
  • [6] PEETERS E, STANDAERT F X, QUISQUATER J J., Power and electromagnetic analysis: Improved model, consequences and comparisons, The VLSI Journal Integration, 40, pp. 52-60, (2007)
  • [7] LI G, POMMERENKE D, MIN J., A low frequency electric field probe for near-field measurement in EMC applications, Proceedings of the International Symposium on Electro-magnetic Compatibility & Signal/Power Integrity(EMCSI), pp. 498-503, (2017)
  • [8] MIN Z, YAN Z, LIU W, Et al., A miniature high sensitivity active electric field probe for near-field measuremen, IEEE Antennas and Wireless Propagation Letters, 18, 12, pp. 2552-2556, (2019)
  • [9] CHEN K, ZHAO Q, ZHANG P, Et al., The power of electromagnetic analysis on embedded cryptographic ICs, Proceedings of the International Conf. on Embedded Software and Systems Symposia(ISESS), pp. 197-201, (2008)
  • [10] AMAGUCHI M Y, TORIDUKA H, KOBAYASHI S, Et al., Development of an on-chip micro shield-loop probe to evaluate performance of magnetic film to protect a cryptographic LSI from electromagnetic analysis, Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, pp. 103-108, (2010)