Test Techniques for 3D-ICs

被引：0
|
作者：
Yotsuyanagi H. [1 ]
机构：
[1] Tokushima University, 2-1 Minami-Josanjima, Tokushima
来源：
Journal of Japan Institute of Electronics Packaging | 2023年 / 26卷 / 07期
关键词：
D O I：
10.5104/JIEP.26.669
中图分类号：
学科分类号：
摘要：
[No abstract available]
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收藏
页码：669 / 674
页数：5
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