Effect of P on Properties of Sn-9Zn-0.1S Lead-Free Solder

被引：0
|
作者：
Li L. [1 ]
Huang H. [1 ]
Zhang Q. [1 ]
Shuai G. [2 ]
机构：
[1] School of Materials Science and Engineering, Nanchang University, Nanchang
[2] School of Aeronautical Manufacturing Engineering, Nanchang HangKong University, Nanchang
来源：
Cailiao Yanjiu Xuebao/Chinese Journal of Materials Research | 2021年 / 35卷 / 08期
关键词：
Corrosion resistance; Metallic materials; Oxidation resistance; Sn-9Zn-0.1S lead-free solder; Wettability;
D O I：
10.11901/1005.3093.2020.408
中图分类号：
学科分类号：
摘要：
The effect of P addition on the microstructure, oxidation resistance, wettability and corrosion resistance of Sn-9Zn-0.1S solder alloy were characterized via optical microscope observation, scanning electron microscopy (SEM) and X-ray diffractometer (XRD), as well as dross removal measurement at different temperatures, spreading area on Cu plate and weight loss measurement after immersion in HCl solution respectively. The results show that P addition can refine the lamellar eutectic microstructures, but coarsen the rod-like primary Zn-rich phases. The oxidation resistance and wettability of the solder can be firstly increased with the addition of P, then this effect reduces, and the optimal P content is 0.06% (mass fraction). At the same time, a suitable amount of P addition can also improve the corrosion resistance of Sn-9Zn-0.1S solder alloy by modifying its microstructure and increasing the density of corrosion products. It is found that the weight loss is the minimum when the P content is 0.1% (mass fraction). © 2021, Editorial Office of Chinese Journal of Materials Research. All right reserved.
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页码：615 / 622
页数：7
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