Research Progress of Diamond / Cu Composites for Thermal Management

被引：0
|
作者：
Li M. [1 ]
Ma Y. [1 ]
Gao J. [1 ,2 ]
Mao Y. [1 ]
Zhou B. [1 ]
Yu S. [1 ]
机构：
[1] Materials Science and Engineering, Taiyuan University of Technology, Taiyuan
[2] State Key Laboratory of Vacuum Electronic Science and Technology, University of Electronic Science and Technology, Chengdu
来源：
Zhongguo Biaomian Gongcheng/China Surface Engineering | 2022年 / 35卷 / 04期
基金：
中国国家自然科学基金;
关键词：
coefficient of thermal expansion; diamond / copper composites; finite element simulation; interface modification; theoretical model; thermal conductivity;
D O I：
10.11933/j.issn.1007-9289.20211113001
中图分类号：
学科分类号：
摘要：
Diamond / copper composites has become the research focus of a new generation of thermal management materials due to its low density, high thermal conductivity and adjustable coefficient of thermal expansion. The diamond / copper composites are reviewed in three directions: theory, experiment and simulation, which is expected to provide reference and ideas for research and industry development in the field of thermal management. This paper reviews the development history of diamond / copper composites, summarizes the important particle mixing theoretical models and “sandwich” composite structure empirical formulas of diamond / copper composites, studies the important factors affecting two thermal performance indicators such as thermal conductivity and thermal expansion coefficient, and briefly describes application of the finite element simulation in diamond / copper composites. Among them, the influence of interface modification (type of active modified elements and thickness of modified layers) on the thermal conductivity of diamond / copper composites is mainly analyzed. The results show that the diamond / copper composites prepared by interfacial modification, increased contact area, and driven by higher temperature and pressure mechanisms have excellent thermophysical properties. Finally, methods such as bimodal diamond, carburizing, and surface texture of large-size diamond self-supporting films are proposed based on the obtained conclusions, which can be used to improve the interface bonding strength and heat dissipation performance of diamond / copper composites. © 2022 Chinese Mechanical Engineering Society. All rights reserved.
引用
收藏
页码：140 / 150
页数：10
相关论文
共 56 条
  • [1] ZWEBEN C., Advanced composites and other advanced materials for electronic packaging thermal management, International Symposium on Advanced Packaging Materials: Processes, Properties & Interfaces, 42, 9, pp. 51-40, (2002)
  • [2] ZHANG Di, YUAN Mengyin, TAN Zhanqiu, Et al., Progress in interface modification and nanoscale study of diamond / Cu composites, Acta Metallurgica Sinica, 54, 11, (2018)
  • [3] KERNS J A, COLELLA N A, MAKOWIECKI D, Dymalloy: A composite substrate for high power density electronic components, Proceedings of 1995 International Symposium on Microelectronics Losangeles, (1995)
  • [4] YASUYUKII A, INOUE K, MIZUUEHI K., Thermal conductivity of copper composites dispersed with diamond particles prepared by spark plasmasintering, The 27th Japan Symposium on Thermophysical Properties, pp. 328-330, (2006)
  • [5] SCHUBERT T, CIUPINSKI L, ZIELINSKI W, Interfacial characterization of Cu / diamond composites prepared by powder metallurgy for heat sink applications, Scripta Materialia, 58, (2008)
  • [6] EKIMOV E A, SUETIN N V, POPOVICH A F, Et al., Thermal conductivity of diamond composites sintered under high pressures, Diamond and Related Materials, 17, 4-5, pp. 838-843, (2008)
  • [7] XIA Y, SONG Y Q, LIN C G, Et al., Effect of carbide formers on microstructure and thermal conductivity of diamond-Cu composites for heat sink materials, Transactions of Nonferrous Metals Society of China, 19, 5, pp. 1161-1166, (2009)
  • [8] ZHANG C, WANG R, CAI Z, Et al., Low-temperature densification of diamond / Cu composite prepared from dual-layer coated diamond particles, Journal of Materials Science Materials in Electronics, 26, 1, pp. 185-190, (2015)
  • [9] MA S, ZHAO N, SHI C, Et al., Mo<sub>2</sub>C coating on diamond: Different effects on thermal conductivity of diamond / Al and diamond / Cu composites, Applied Surface Science, 402, pp. 372-383, (2017)
  • [10] WANG Luhua, Interfacial structure and thermal conductivity of Cu / diamond composites, (2019)
123456