Summary of the 11th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells

This article reports on the 11th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells, which took place in May 2023 in Neuchatel, Switzerland. An important observation at the workshop was that, while screen printing is still dominating metallization, alternative pastes with increasing Cu content are starting to be implemented in the industry in response to the need to decrease cost and improve sustainability. Compared to previous workshops, interconnection topics were more prevalent in this edition because of the need for interconnection solutions that work at lower temperatures, as is needed for emerging solar cell technologies. Electrically conductive adhesives (ECA) have gained in importance in this respect. Understanding of reliability aspects and insight into proper characterization of ECAs are increasing, yet the challenge is here is to substantially further reduce cost and silver content.