Overcoming the doping limit in GaAs by ion implantation and pulsed laser melting

被引:1
|
作者
Yu, Kin Man [1 ,2 ]
Scarpulla, M. A. [3 ]
Ho, Chun Yuen [4 ]
Dubon, O. D. [2 ,5 ]
Walukiewicz, W. [2 ]
机构
[1] City Univ Hong Kong, Dept Phys, Kowloon, Hong Kong, Peoples R China
[2] Lawrence Berkeley Natl Lab, Mat Sci Div, Berkeley, CA 94720 USA
[3] Univ Utah, Dept Mat Sci & Engn, Salt Lake City, UT 84112 USA
[4] Univ Southern Denmark, Mads Clausen Inst, Ctr Adv Photovolta & Thin Film Energy Devices, DK-6400 Sonderborg, Denmark
[5] Univ Calif Berkeley, Dept Mat Sci & Engn, Berkeley, CA 90089 USA
关键词
NATIVE DEFECTS; POINT-DEFECTS; SEMICONDUCTORS; ZNSE;
D O I
10.1063/5.0190600
中图分类号
O59 [应用物理学];
学科分类号
摘要
Most semiconductors exhibit a saturation of free carriers when heavily doped with extrinsic dopants. This carrier saturation or "doping limit" is known to be related to the formation of native compensating defects, which, in turn, depends on the energy positions of their conduction band minimum and valence band maximum. Here, we carried out a systematic study on the n-type doping limit of GaAs via ion implantation and showed that this doping limitation can be alleviated by the transient process of pulsed laser melting (PLM). For n-type doping, both group VI (S) and amphoteric group IV (Si and Ge) dopants were implanted in GaAs. For comparison, p-type doping was also studied using Zn as the acceptor. Implanted dopants were activated by the PLM method, and the results are compared to rapid thermal annealing (RTA). Our results reveal that for all n-type dopants, while implantation followed by the RTA results in a similar saturation electron concentration of 2-3 x 10(18) cm(-3), the transient PLM process is capable of trapping high concentration of dopants in the substitutional site, giving rise to a carrier concentration of >10(19) cm(-3), exceeding the doping limit of GaAs. However, due to scatterings from point defects generated during PLM, the mobility of n-type GaAs after PLM is low (similar to 80-260 cm(2)/V s). Subsequent RTA after PLM (PLM + RTA) is able to remove these point defects and recover the mobility to similar to 1000-2000 cm(2)/V s. The carrier concentrations of these PLM + RTA samples are reduced but are still a factor of 3 higher than RTA only GaAs. This can be understood as the dopants are already incorporated in the substitutional site after PLM; they are less likely to be "deactivated" by subsequent RTA. This work is significant to the understanding of doping mechanisms in semiconductors and provides a means for device applications, which require materials with ultra-high doping. (c) 2024 Author(s). All article content, except where otherwise noted, is licensed under a Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International (CC BY-NC-ND) license (https://creativecommons.org/licenses/by-nc-nd/4.0/).
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页数:11
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