Ag3Sn粗化模型及其对Sn-Ag-Cu焊料蠕变的影响

被引：6

作者：

王小京 ^{[1
]}

祝清省 ^{[1
]}

王中光 ^{[1
]}

尚建库 ^{[1
,2
]}

机构：

[1] 中国科学院金属研究所沈阳材料科学国家(联合)实验室

[2] Department of Materials Science and Engineering,University of Illinois at

来源：

金属学报 | 2009年 / 45卷 / 08期

关键词：

无铅焊料; 粒子粗化; 电流;

D O I：

暂无

中图分类号：

TG40 [焊接一般性问题];

学科分类号：

摘要：

本文用位错蠕变模型,描述了在电流作用下,无铅焊料Sn-Ag-Cu（SAC）中第二相粒子-Ag3Sn的粗化过程及其对蠕变速率的影响.模型中焊料组织被简化为:β-Sn母相基体和在基体上弥散分布的Ag3Sn第二相粒子.基于Lifshitz-Wagner理论,得到了描述第二相粒子尺寸演化的关系式,式中包括稳态应变和电流作用引起的两部分组化.

引用

页码：912 / 918

页数：7

共 11 条

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