ANALYSIS OF DIMENSIONAL CHANGES DURING SINTERING OF FE-CU

被引:50
|
作者
KAYSSER, WA
HUPPMANN, WJ
PETZOW, G
机构
关键词
D O I
10.1179/pom.1980.23.2.86
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
引用
收藏
页码:86 / 91
页数:6
相关论文
共 50 条
  • [1] DIMENSIONAL CHANGES DURING LIQUID-PHASE SINTERING OF FE-CU COMPACTS
    TABESHFAR, K
    CHADWICK, GA
    POWDER METALLURGY, 1984, 27 (01) : 19 - 24
  • [2] FORMATION OF CU POCKETS IN FE GRAINS DURING THE SINTERING OF FE-CU ALLOYS
    HWANG, NM
    KANG, SJL
    YOON, DN
    METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1986, 17 (08): : 1429 - 1431
  • [3] FORMATION OF Cu POCKETS IN Fe GRAINS DURING THE SINTERING OF Fe-Cu ALLOYS.
    Hwang, Nong-Moon
    Kang, Suk-Joong L.
    Yoon, Duk N.
    Metallurgical transactions. A, Physical metallurgy and materials science, 1986, 17 A (08): : 1429 - 1431
  • [4] DIMENSIONAL CHANGES DURING SINTERING OF PREALLOYED FE-CU-C POWDERS
    ANGERS, R
    TRUDEL, Y
    INTERNATIONAL JOURNAL OF POWDER METALLURGY, 1974, 2 (10): : 111 - 112
  • [5] DIMENSIONAL CHANGES OF SINTERED FE-NI, FE-CU, FE-NI-CU ALLOYS
    ZAPF, G
    DALAL, K
    NIESSEN, J
    POWDER METALLURGY, 1972, 15 (30) : 228 - &
  • [6] INVESTIGATION AND ANALYSIS OF LIQUID-PHASE SINTERING OF FE-CU AND FE-CU-C COMPACTS
    JAMIL, SJ
    CHADWICK, GA
    POWDER METALLURGY, 1985, 28 (02) : 65 - 71
  • [7] An investigation on microwave sintering of Fe, Fe-Cu and Fe-Cu-C alloys
    Annamalai, Raja
    Upadhyaya, Anish
    Agrawal, Dinesh
    BULLETIN OF MATERIALS SCIENCE, 2013, 36 (03) : 447 - 456
  • [8] PARTICLE GROWTH BY COALESCENCE DURING LIQUID-PHASE SINTERING OF FE-CU
    KAYSSER, WA
    TAKAJO, S
    PETZOW, G
    ACTA METALLURGICA, 1984, 32 (01): : 115 - 122
  • [9] A study on laser sintering of Fe-Cu powder compacts
    Shen, P
    Hu, JD
    Guo, ZX
    Guan, QF
    METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1999, 30 (08): : 2229 - 2235
  • [10] Sintering of Fe-Cu systems activated by the liquid phase
    Powder Metallurgy Science & Technology, 1992, 3 (02):