INOVA MAKES ITS MOVE IN RISKY WAFER-SCALE WORK

被引：0

作者：

BENNETT, E

机构：

来源：

ELECTRONICS | 1985年 / 58卷 / 48期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：57 / 58

页数：2

共 50 条

[1] INOVA BRINGS WAFER-SCALE INTEGRATION TO MARKET
COLE, BC
ELECTRONICS, 1987, 60 (01): : 91 - 93
[2] CONFERENCE SPOTLIGHTS WORK ON WAFER-SCALE CIRCUITS
BURSKY, D
ELECTRONIC DESIGN, 1990, 38 (04) : 34 - +
[3] DONT WRITE OFF WAFER-SCALE WORK - ITS STILL GOING STRONG
COLE, BC
ELECTRONICS, 1987, 60 (01): : 94 - 95
[4] WAFER-SCALE INTEGRATION
CATT, I
WIRELESS WORLD, 1982, 88 (1554): : 67 - 67
[5] WAFER-SCALE INTEGRATION
DAVIS, B
IEEE SPECTRUM, 1984, 21 (12) : 16 - 16
[6] WAFER-SCALE INTEGRATION
THORPE, T
WIRELESS WORLD, 1981, 87 (1548): : 43 - 43
[7] THE TRIALS OF WAFER-SCALE INTEGRATION
MCDONALD, JF
ROGERS, EH
ROSE, K
STECKL, AJ
IEEE SPECTRUM, 1984, 21 (10) : 32 - 39
[8] WAFER-SCALE FACES PESSIMISM
COLE, BC
ELECTRONICSWEEK, 1985, 58 (13): : 49 - 53
[9] WAFER-SCALE INTEGRATION - FOREWORD
CHAPMAN, GH
BREWER, JE
TEWKSBURY, SK
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1995, 18 (03): : 404 - 405
[10] WAFER-SCALE KERNEL TESTING
CATT, I
ELECTRONICS & WIRELESS WORLD, 1989, 95 (1638): : 401 - &