ELECTRICAL PROPERTIES OF AN EPOXY RESIN DURING AND AFTER CURING

被引：34
|
作者：
ADAMEC, V
机构：
来源：
JOURNAL OF POLYMER SCIENCE PART A-1-POLYMER CHEMISTRY | 1972年 / 10卷 / 05期
关键词：
D O I：
10.1002/pol.1972.150100501
中图分类号：
O63 [高分子化学（高聚物）];
学科分类号：
070305 ; 080501 ; 081704 ;
摘要：
引用
收藏
页码：1277 / &
相关论文
共 50 条
  • [1] The Effect of Curing Conditions on the Electrical Properties of an Epoxy Resin
    Saeedi, Istebreq A.
    Vaughan, Alun S.
    Andritsch, Thomas
    Virtanen, Suvi
    [J]. 2016 IEEE CONFERENCE ON ELECTRICAL INSULATION AND DIELECTRIC PHENOMENA (IEEE CEIDP), 2016, : 461 - 464
  • [2] Preparation and electrical properties of recyclable high performance dual-curing epoxy resin
    Wang, Haohuan
    Qin, Ling
    Wang, Tianxing
    Shi, Lingna
    Wu, Jinsuo
    Wen, Sen
    [J]. Fuhe Cailiao Xuebao/Acta Materiae Compositae Sinica, 2024, 41 (08): : 4103 - 4112
  • [3] Rapid curing epoxy resin and the properties of carbon fiber/epoxy composite
    [J]. Gu, Y. (benniegu@buaa.edu.cn), 1600, Beijing University of Aeronautics and Astronautics (BUAA) (30):
  • [4] FLOW PROPERTIES OF EPOXY-RESIN AT CURING PROCESS
    GOTO, K
    KAWAI, R
    [J]. KOBUNSHI RONBUNSHU, 1978, 35 (02) : 75 - 79
  • [5] Curing properties of an epoxy resin containing biphenyl structure
    Zhang, CL
    Na, H
    Mu, JX
    Yu, WZ
    Fu, TZ
    Zhang, XG
    Li, ZC
    Wu, ZW
    [J]. CHEMICAL JOURNAL OF CHINESE UNIVERSITIES-CHINESE, 2004, 25 (09): : 1756 - 1758
  • [6] The curing characteristics and properties of bisphenol A epoxy resin/maleopimaric acid curing system
    Liu, Hechen
    Wu, Xuan
    Liu, Yunpeng
    Guo, Zhanpeng
    Ge, Qi
    Sun, Zhanglin
    [J]. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2022, 21 : 1655 - 1665
  • [7] The curing characteristics and properties of bisphenol A epoxy resin/maleopimaric acid curing system
    Liu, Hechen
    Wu, Xuan
    Liu, Yunpeng
    Guo, Zhanpeng
    Ge, Qi
    Sun, Zhanglin
    [J]. Journal of Materials Research and Technology, 2022, 21 : 1655 - 1665
  • [8] EPOXY-RESIN CURING
    LUTTGERT, KE
    BONART, R
    [J]. COLLOID AND POLYMER SCIENCE, 1976, 254 (03) : 310 - 318
  • [9] Surface migration of fluorinated additive during the curing of epoxy resin
    Glaris, P.
    Coulon, J. F.
    Dorget, M.
    Poncin-Epaillard, F.
    [J]. COMPOSITES PART B-ENGINEERING, 2015, 73 : 10 - 15
  • [10] CONTRACTIVE STRESS OF EPOXY-RESIN DURING ISOTHERMAL CURING
    IGARASHI, T
    KONDO, S
    KUROKAWA, M
    [J]. POLYMER, 1979, 20 (03) : 301 - 304
12345