An evolutionary design methodology of printed circuit boards for high-speed VLSIs

被引:1
|
作者
Yasunaga, Moritoshi [1 ]
Yoshihara, Ikuo [2 ]
机构
[1] Univ Tsukuba, Fac Engn Informat & Syst, Tsukuba, Ibaraki, Japan
[2] Miyazaki Univ, Fac Engn, Miyazaki, Miyazaki 88921, Japan
关键词
Genetic algorithm; Signal integrity; Power integrity; Printed circuit board;
D O I
10.1007/s10015-016-0266-9
中图分类号
TP24 [机器人技术];
学科分类号
080202 ; 1405 ;
摘要
As operation frequencies of the printed circuit boards (PCBs) increase in keeping with VLSI frequencies in the GHz domain, two independent serious problems occur in the PCB design. One is waveform distortion problem, or signal integrity (SI) degradation problem, in PCB traces. And the other is power-supply drop problem, or power integrity (PI) degradation problem, in PCB power planes. Those problems are barely able to be overcome on case-by-case empirical designs conventionally. In this paper we newly propose a design approach for each problem, both of which are based on the genetic algorithm. And we obtained improvement ratios of more than double compared with the both conventional designs for SI and PI degradations, respectively.
引用
收藏
页码:171 / 176
页数:6
相关论文
共 50 条
  • [1] High-Speed Printed Circuit Boards: A Tutorial
    Abu Khater, Mohammad
    [J]. IEEE CIRCUITS AND SYSTEMS MAGAZINE, 2020, 20 (03) : 34 - 45
  • [2] Limitations of High-Speed Square Pulses on Printed Circuit Boards
    Sigmund, Milan
    Brancik, Lubomir
    [J]. 2017 27TH EAEEIE ANNUAL CONFERENCE (EAEEIE), 2017,
  • [3] Length-matching routing for high-speed printed circuit boards
    Ozdal, MM
    Wong, MDF
    [J]. ICCAD-2003: IEEE/ACM DIGEST OF TECHNICAL PAPERS, 2003, : 394 - 400
  • [4] Back-drilling of high-speed printed circuit boards: a review
    Hongyan Shi
    Tao Zhu
    Zhuangpei Chen
    [J]. The International Journal of Advanced Manufacturing Technology, 2022, 121 : 1483 - 1499
  • [5] Back-drilling of high-speed printed circuit boards: a review
    Shi, Hongyan
    Zhu, Tao
    Chen, Zhuangpei
    [J]. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2022, 121 (3-4): : 1483 - 1499
  • [6] A new probing technique for high-speed/high-density printed circuit boards
    Parker, KP
    [J]. INTERNATIONAL TEST CONFERENCE 2004, PROCEEDINGS, 2004, : 365 - 374
  • [7] Two-layer bus routing for high-speed printed circuit boards
    Ozdal, MM
    Wong, MDF
    [J]. ACM TRANSACTIONS ON DESIGN AUTOMATION OF ELECTRONIC SYSTEMS, 2006, 11 (01) : 213 - 227
  • [8] High-Speed Signal Optimization at Differential VIAs in Multilayer Printed Circuit Boards
    Xu, Wen-Jie
    Xin, Dong-Jin
    Yang, Lei
    Zhou, Yong-Kang
    Wang, Dong
    Li, Wei-Xin
    [J]. ELECTRONICS, 2024, 13 (17)
  • [9] TRANSIENT ANALYSIS OF A MICROSTRIP DIFFERENTIAL PAIR FOR HIGH-SPEED PRINTED CIRCUIT BOARDS
    Nicolaescu, Mircea
    Croitoru, Victor
    Tuta, Leontin
    [J]. REVUE ROUMAINE DES SCIENCES TECHNIQUES-SERIE ELECTROTECHNIQUE ET ENERGETIQUE, 2022, 67 (02): : 167 - 170
  • [10] Analysis of via in multilayer printed circuit boards for high-speed digital systems
    Kim, JH
    Han, SW
    Kwon, OK
    [J]. ADVANCES IN ELECTRONIC MATERIALS AND PACKAGING 2001, 2001, : 382 - 387