Glass enamels in the electronics industry

被引：1
|
作者：
Bobkova, NM [1 ]
机构：
[1] BELARUS STATE TECHNOL UNIV, MINSK, BELARUS
来源：
GLASS AND CERAMICS | 1995年 / 52卷 / 5-6期
关键词：
D O I：
10.1007/BF00679974
中图分类号：
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
An analytical review of the scientific engineering and patent literature on different types of dielectric materials for substrates of thick-film hybrid integral circuits is presented. The compositions and properties of glass enamels for steel substrates used in the production of HIC, the methods for depositing enamels on steel substrates, and their applications are considered.
引用
收藏
页码：107 / 111
页数：5
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