THE INTERACTION KINETICS AND COMPOUND FORMATION BETWEEN ELECTROLESS NI-P AND SOLDER

被引：94
|
作者：
LEE, CY
LIN, KL
机构：
[1] Department of Materials Science and Engineering, National Cheng Kung University, Tainan
来源：
THIN SOLID FILMS | 1994年 / 249卷 / 02期
关键词：
D O I：
10.1016/0040-6090(94)90761-7
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The interdiffusion between an electroless Ni-P deposit and liquid solder was investigated with the aid of an X-ray diffractometer and a scanning electron microscope to identify the intermetallic compounds formed. Sn was found to be the dominant diffusing atom in the interdiffusion process according to analysis by Auger electron spectroscopy. The intermetallic compounds Ni3Sn4 and Ni3Sn2 were formed between Ni-P and the solder in which phosphorus was also detected. The kinetics of the formation of intermetallic compounds and the activation energy for the diffusion of Sn were investigated.
引用
收藏
页码：201 / 206
页数：6
相关论文
共 50 条
  • [1] Kinetics of electroless Ni-P alloy deposition
    Harbin University of Science and Technology, Harbin 150040, China
    不详
    Xiyou Jinshu Cailiao Yu Gongcheng, 2008, 11 (1951-1955):
  • [2] Kinetics of Electroless Ni-P Alloy Deposition
    Li Libo
    An Maozhong
    RARE METAL MATERIALS AND ENGINEERING, 2008, 37 (11) : 1951 - 1955
  • [3] Wetting kinetics and the interfacial interaction behavior between electroless Ni-Cu-P and molten solder
    Lee, Chwan-Ying
    Lin, Kwang-Lung
    Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 1994, 33 (5 A): : 2684 - 2688
  • [4] WETTING KINETICS AND THE INTERFACIAL INTERACTION BEHAVIOR BETWEEN ELECTROLESS NI-CU-P AND MOLTEN SOLDER
    LEE, CY
    LIN, KL
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1994, 33 (5A): : 2684 - 2688
  • [5] Reliability study of the electroless Ni-P layer against solder alloy
    Alam, MO
    Chan, YC
    Hung, KC
    MICROELECTRONICS RELIABILITY, 2002, 42 (07) : 1065 - 1073
  • [6] KINETICS OF INTERMETALLIC COMPOUND GROWTH BETWEEN NICKEL, ELECTROLESS NI-P, ELECTROLESS NI-B AND TIN AT 453-K TO 493-K
    TOMLINSON, WJ
    RHODES, HG
    JOURNAL OF MATERIALS SCIENCE, 1987, 22 (05) : 1769 - 1772
  • [7] Characterisation of electroless Ni-P and electroless composite coatings Ni-P/Ni-PTFE
    Karaguiozova, Zdravka K.
    INTERNATIONAL JOURNAL OF SURFACE SCIENCE AND ENGINEERING, 2018, 12 (5-6) : 496 - 506
  • [8] Growth kinetics of Ni3Sn4 and Ni3P layer between Sn-3.5Ag solder and electroless Ni-P substrate
    Yoon, JW
    Jung, SB
    JOURNAL OF ALLOYS AND COMPOUNDS, 2004, 376 (1-2) : 105 - 110
  • [9] Study on Kinetics of Electroless Plating Palladiumon on Ni-P Coatings
    Wu, Daoxin
    Liu, Ying
    Xiao, Zhongliang
    FUNDAMENTAL OF CHEMICAL ENGINEERING, PTS 1-3, 2011, 233-235 : 2840 - 2843
  • [10] Intermetallic compound layer formation between Sn-3.5 mass %Ag BGA solder ball and (Cu, immersion Au/electroless Ni-P/Cu) substrate
    Lee, CB
    Yoon, JW
    Suh, SJ
    Jung, SB
    Yang, CW
    Shur, CC
    Shin, YE
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2003, 14 (08) : 487 - 493
12345