ELECTRONIC PACKAGING IN THE 1990S - A PERSPECTIVE FROM ASIA

被引：7
|
作者：
OHSAKI, T
机构：
[1] NTT Applied Electronics Laboratories, Musashino-shi
来源：
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1991年 / 14卷 / 02期
关键词：
D O I：
10.1109/33.87303
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Evolution of many electronic packaging techniques is required by the advanced information society. An overview of the present status and future trends in electronic packaging technologies are reviewed. Advanced modules packaged with these technologies are shown in three major systems: switching systems, transmission systems, and computer systems.
引用
收藏
页码：254 / 261
页数：8
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