MIXED-SIGNAL SIMULATION IS PROVEN

被引:0
|
作者
GOODENOUGH, F
机构
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:16 / 16
页数:1
相关论文
共 50 条
  • [1] MIXED-SIGNAL MODELING AND SIMULATION
    WIMBROW, M
    [J]. ELECTRONIC DESIGN, 1992, 40 (23) : 47 - 47
  • [2] Mixed-signal simulation & test generation
    Dufils, Martine
    Carbonero, Jean-Louis
    Planelle, Philippe
    Raynaud, Philippe
    [J]. IEEE DTIS: 2006 INTERNATIONAL CONFERENCE ON DESIGN & TEST OF INTEGRATED SYSTEMS IN NANOSCALE TECHNOLOGY, PROCEEDINGS, 2006, : 228 - 233
  • [3] Selected topics in mixed-signal simulation
    Christen, E
    [J]. SYSTEM SPECIFICATION AND DESIGN LANGUAGES: BEST OF FDL '02, 2003, : 5 - 17
  • [4] Mixed-signal simulation with the simbus backplane
    Hickey, DR
    Wilsey, PA
    Hoekstra, RJ
    Keiter, ER
    Hutchinson, SA
    Russo, TV
    [J]. 39TH ANNUAL SIMULATION SYMPOSIUM, PROCEEDINGS, 2006, : 223 - +
  • [5] Mixed-signal simulation and test generation
    Dufils, M.
    Carbonero, J. L.
    Planelle, P.
    Raynaud, P.
    [J]. INTERNATIONAL JOURNAL OF ELECTRONICS, 2008, 95 (03) : 239 - 248
  • [6] NEW DIRECTIONS FOR MIXED-SIGNAL SIMULATION
    WALSH, KM
    [J]. ELECTRONIC PRODUCTS MAGAZINE, 1995, 38 (04): : 25 - 27
  • [7] Fault simulation for mixed-signal systems
    Siemens Automotive, Toulouse, France
    [J]. J Electron Test Theory Appl JETTA, 2 (143-152):
  • [8] Fault simulation for mixed-signal systems
    Caunegre, P
    Abraham, C
    [J]. JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 1996, 8 (02): : 143 - 152
  • [9] Mixed-signal simulation by way of the Simbus backplane
    Martin, DE
    Wilsey, PA
    Hoekstra, RJ
    Keiter, ER
    Hutchinson, SA
    Russo, TV
    [J]. BMAS 2004: IEEE INTERNATIONAL BEHAVIORAL MODELING AND SIMULATION CONFERENCE - PROCEEDINGS, 2004, : 74 - 79
  • [10] Fast Mixed-Signal Simulation using SystemC
    Hoelldampf, Stefan
    Zaum, Daniel
    Neumann, Ingmar
    Olbrich, Markus
    Barke, Erich
    [J]. 2011 IEEE INTERNATIONAL SYSTEMS CONFERENCE (SYSCON 2011), 2011, : 527 - 530