FUTURE ADMINISTRATION - PROBLEM OF PRINTED-CIRCUIT BOARD MANAGEMENT

被引：0

作者：

不详

机构：

来源：

GALVANOTECHNIK | 1979年 / 70卷 / 08期

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D O I：

暂无

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

引用

页码：803 / &

共 50 条

[1] THE THERMAL MANAGEMENT OF PRINTED-CIRCUIT BOARD ASSEMBLIES
FINCH, DJ
GOODACRE, JB
[J]. MARCONI REVIEW, 1982, 45 (227): : 189 - 214
[2] THE FUTURE OF METALLIZATION TECHNIQUES IN THE PRINTED-CIRCUIT BOARD INDUSTRY
NARGI, KA
GOLDMAN, PJ
[J]. PLATING AND SURFACE FINISHING, 1987, 74 (02): : 45 - 45
[3] THE FUTURE OF METALLIZATION TECHNIQUES IN THE PRINTED-CIRCUIT BOARD INDUSTRY
NARGI, KA
GOLDMAN, PJ
[J]. PLATING AND SURFACE FINISHING, 1987, 74 (05): : 38 - 38
[4] SOLVING A RELIABILITY PROBLEM IN PRINTED-CIRCUIT BOARD FABRICATION
HAMMERBERG, CC
SMITH, AW
[J]. METAL PROGRESS, 1979, 116 (03): : 54 - 56
[5] DYNAMIC STIFFENING OF A PRINTED-CIRCUIT BOARD
LAURA, PAA
ERCOLI, L
LAMALFA, S
[J]. ACUSTICA, 1995, 81 (02): : 196 - 197
[6] SPC IN PRINTED-CIRCUIT BOARD ASSEMBLY
DOBBINS, JG
PADGETT, WJ
[J]. QUALITY PROGRESS, 1993, 26 (07) : 65 - 67
[7] PRECISION IN THE PRINTED-CIRCUIT BOARD INDUSTRY
SCARLETT, JA
[J]. PRECISION ENGINEERING-JOURNAL OF THE AMERICAN SOCIETY FOR PRECISION ENGINEERING, 1981, 3 (04): : 238 - 246
[8] CHIP ON HOLE PRINTED-CIRCUIT BOARD
TANIMOTO, M
EDO, K
OKITA, K
SHIGEMASA, J
[J]. SHARP TECHNICAL JOURNAL, 1991, (51): : 77 - 80
[9] PRINTED-CIRCUIT BOARD BUS BARS
STREDDE, GH
[J]. WESTERN ELECTRIC ENGINEER, 1979, 23 (01): : 19 - 23
[10] Modeling for printed-circuit board simulation
Balaram, A
[J]. IEEE SPECTRUM, 2000, 37 (10) : 70 - 74