EXTENDING SPICE FOR ELECTROTHERMAL SIMULATION

被引：0
|
作者：
VOGELSONG, RS
BRZEZINSKI, C
机构：
来源：
PROCEEDINGS OF THE IEEE 1989 CUSTOM INTEGRATED CIRCUITS CONFERENCE | 1989年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：631 / 634
页数：4
相关论文
共 50 条
  • [1] SPICE Modeling and Dynamic Electrothermal Simulation of SiC Power MOSFETs
    d'Alessandro, V.
    Magnani, A.
    Riccio, M.
    Breglio, G.
    Irace, A.
    Rinaldi, N.
    Castellazzi, A.
    2014 IEEE 26TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES & IC'S (ISPSD), 2014, : 285 - 288
  • [2] DYNAMIC SPICE-SIMULATION OF THE ELECTROTHERMAL BEHAVIOR OF SOI MOSFETS
    BIELEFELD, J
    PELZ, G
    ABEL, HB
    ZIMMER, G
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1995, 42 (11) : 1968 - 1974
  • [3] Electrothermal model of optocoupler for SPICE
    Gorecki, Krzysztof
    Stepowicz, Witold J.
    INTERNATIONAL JOURNAL OF NUMERICAL MODELLING-ELECTRONIC NETWORKS DEVICES AND FIELDS, 2009, 22 (04) : 321 - 333
  • [4] Electrothermal model of a power LED for SPICE
    Gorecki, Krzysztof
    INTERNATIONAL JOURNAL OF NUMERICAL MODELLING-ELECTRONIC NETWORKS DEVICES AND FIELDS, 2012, 25 (01) : 39 - 45
  • [5] THE ELECTROTHERMAL MODEL OF THE PULSE TRANSFORMER FOR SPICE
    Gorecki, Krzysztof
    Zarebski, Janusz
    INTERNATIONAL JOURNAL OF ELECTRONICS AND TELECOMMUNICATIONS, 2005, 51 (03) : 421 - 437
  • [6] Feasibility study on a contact-less direct thermal printing with electrothermal SPICE simulation
    Chen, YM
    Shie, JS
    SENSORS AND ACTUATORS A-PHYSICAL, 2001, 88 (02) : 93 - 103
  • [7] Compact modeling and SPICE-based simulation for electrothermal analysis of multilevel ULSI interconnects
    Chiang, TY
    Banerjee, K
    Saraswat, KC
    ICCAD 2001: IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER AIDED DESIGN, DIGEST OF TECHNICAL PAPERS, 2001, : 165 - 172
  • [8] Direct SPICE-like 3-D Electrothermal Simulation of Power HEMTs
    Cernaj, L'.
    Chvala, A.
    Marek, J.
    Donoval, D.
    Zavodnik, T.
    Kozarik, J.
    Jagelka, M.
    Donoval, M.
    2018 12TH INTERNATIONAL CONFERENCE ON ADVANCED SEMICONDUCTOR DEVICES AND MICROSYSTEMS (ASDAM), 2018, : 175 - 178
  • [9] Extending SPICE with FDTD and generalized characteristic model for coupled microstrip lines simulation
    Ip, SK
    Chang, FY
    2003 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3, 2003, : 2077 - 2080
  • [10] COUPLED ELECTROTHERMAL MODELING OF MICROHEATERS USING SPICE
    SWART, NR
    NATHAN, A
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1994, 41 (06) : 920 - 925
12345