THE INFLUENCE OF DWELL TIME ON RELIABILITY OF SMT SOLDER JOINTS UNDER THERMAL CYCLING

被引：3
|
作者：
HUANG, JH [1 ]
JIANG, YH [1 ]
QIAN, YY [1 ]
机构：
[1] HARBIN INST TECHNOL,HARBIN 150006,PEOPLES R CHINA
来源：
MICROELECTRONICS AND RELIABILITY | 1994年 / 34卷 / 05期
关键词：
D O I：
10.1016/0026-2714(94)90013-2
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The influence of dwell time on mechanical behaviour and fatigue life of SMT solder joints under thermal cycling has been investigated. ?he dwell time has two effects on the mechanical behaviour of SMT solder joints under thermal cycling: first, in the dwell time of high-temperature part, the stress in SMT solder joints will notably relax, and secondly, as the dwell time increases, the stress in solder joints in the low-temperature part of thermal cycling increases. With the increase of dwell time, the life of SMT solder joints under thermal lycling exponentially decreases.
引用
收藏
页码：897 / 904
页数：8
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