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- [1] THE HYDROSTATIC MODEL OF THE REDISTRIBUTION OF THE TIN-LEAD ALLOY IN THE MELTING OF THE COATING OF PRINTED-CIRCUIT BOARDS WELDING PRODUCTION, 1980, 27 (02): : 19 - 21
- [2] COMPOSITION ANALYSIS OF TIN-LEAD PLATINGS ON PRINTED-CIRCUIT BOARDS BY BETA-BACKSCATTER METHOD INTERNATIONAL JOURNAL OF APPLIED RADIATION AND ISOTOPES, 1976, 27 (11): : 631 - 636
- [3] BETA-BACKSCATTER GAUGE FOR TIN-LEAD ANALYSIS OF PRINTED-CIRCUIT BOARDS TRANSACTIONS OF THE AMERICAN NUCLEAR SOCIETY, 1979, 32 (JUN): : 212 - 213
- [4] ELECTROLYTIC DEPOSITION OF BRIGHT COATINGS OF TIN-LEAD ALLOY PROTECTION OF METALS, 1978, 14 (05): : 516 - 517
- [5] SURFACE-COMPOSITION OF A TIN-LEAD ALLOY JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1982, 20 (04): : 939 - 942
- [6] SOLDERING OF ELECTROLYTIC TIN AND TIN-LEAD COATINGS MECHANIK MIESIECZNIK NAUKOWO-TECHNICZNY, 1974, 47 (10): : 600 - 600
- [7] Selective Desoldering Separation of Tin-Lead Alloy for Dismantling of Electronic Components from Printed Circuit Boards ACS SUSTAINABLE CHEMISTRY & ENGINEERING, 2015, 3 (08): : 1696 - 1700
- [9] SELF-DIFFUSION OF TIN IN A LIQUID TIN-LEAD ALLOY AT EUTECTIC COMPOSITION ZEITSCHRIFT FUR NATURFORSCHUNG SECTION A-A JOURNAL OF PHYSICAL SCIENCES, 1976, 31 (08): : 1024 - 1024