METALLIZATION ISSUES IN ADVANCED CERAMIC SUBSTRATES - MICROSTRUCTURAL, MICROCHEMISTRY AND THERMAL-CONDUCTIVITY IN A1N

被引：1
|
作者：
WESTWOOD, AD
NOTIS, MR
机构：
来源：
ELECTRONIC PACKAGING MATERIALS SCIENCE IV | 1989年 / 154卷
关键词：
D O I：
10.1557/PROC-154-479
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
引用
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页码：479 / 485
页数：7
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