MODULAR DESIGN THERMOFORMING MACHINES - FLEXIBLE HARDWARE FOR MANY PACKAGING DUTIES

被引：0
|
作者：
KUTTENBAUM, V
机构：
来源：
VERPACKUNGS RUNDSCHAU | 1979年 / 30卷 / 03期
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中图分类号：
TS2 [食品工业];
学科分类号：
0832 ;
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页码：266 / &
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