ON HIGH-SPEED PRECISION BLANKING OF IC LEAD-FRAMES USING A PROGRESSIVE DIE

被引:9
|
作者
JIMMA, T
SEKINE, F
机构
[1] Research Laboratory of Precision Machinery and Electronics, Tokyo Institute of Technology, Midori-ku, Yokohama, 227
关键词
D O I
10.1016/0924-0136(90)90018-P
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The factors affecting the dimensional accuracy of blanked IC lead-frames are discussed. Attention is focussed on the elimination of the residual stress in the material caused by roll-slitting. Improvement in the designing and manufacturing of the blanking tool is explained and the mechanism of vibration of the stripper in high-speed blanking is analyzed. A high speed precision press that has been developed in Japan is introduced. The effects of blanking conditions such as tool clearance, strip-holding force, lead-shape, and order of blanking are explained, using a newly proposed mechanical model. © 1990.
引用
收藏
页码:291 / 305
页数:15
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