Analysis of a Complete Contact Problem in Bonded Condition: Comparison of Experimental-Numerical Analyses and Theoretical Solutions

被引:0
|
作者
Kim, Hyung-Kyu [1 ]
Jang, Jae-Won [2 ]
Lee, Soon-Bok [2 ]
机构
[1] Korea Atom Energy Res Inst, Daejeon, South Korea
[2] Korea Adv Inst Sci & Technol, Daejeon, South Korea
关键词
Complete Contact; Moire Experiment; Finite Element Analysis;
D O I
10.3795/KSME-A.2015.39.6.583
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
Asymptotic method has been often used to theoretically analyze the complete contact problem. The error of the asymptotic results increases as the distance from the contact edge increases. The singularity cannot be properly obtained from a finite element (FE) analysis owing to the finiteness of the element size. In the present work, the complete contact problem in bonded condition is analyzed using a combined experimental-numerical approach to assist and/or compare with the asymptotic results. Al and Cu alloys are used for the material combination of the punch and substrate. 120 and 135 degrees are used for the punch angle. The FE models are validated by comparison of displacement distributions obtained by the FE analysis and moire experiment. Generalized stress intensity factors are evaluated using the validated FE models. Stress field in the vicinity of the sharp contact edges obtained from the FE and asymptotic analyses are compared. The discrepancies are also discussed.
引用
收藏
页码:583 / 588
页数:6
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