FRACTURE STRENGTH OF FREESTANDING CHEMICALLY VAPOR-DEPOSITED DIAMOND FILMS

被引：6
|
作者：
STEYER, TE
FABER, KT
DRORY, MD
机构：
[1] NORTHWESTERN UNIV,DEPT MAT SCI & ENGN,EVANSTON,IL 60208
[2] CRYSTALLUME INC,SANTA CLARA,CA 95054
来源：
APPLIED PHYSICS LETTERS | 1995年 / 66卷 / 23期
关键词：
D O I：
10.1063/1.113617
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
The fracture strength of free-standing chemically vapor-deposited diamond films was assessed by four-point bending. A two-parameter Weibull analysis was performed on 130 μm thick films resulting in a Weibull modulus of 4.3 and a statistical scaling stress of 626 MPa. The residual stress in films was measured from the free-standing film curvature to be 384±10 MPa. The fracture surface chemistry was examined using scanning Auger spectroscopy. The fracture did not occur preferentially along grain boundaries.© 1995 American Institute of Physics.
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收藏
页码：3105 / 3107
页数：3
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