USING SIMULATION TO ANALYZE INTEGRATED TOOL PERFORMANCE IN SEMICONDUCTOR MANUFACTURING

被引:4
|
作者
MAUER, J
SCHELASIN, R
机构
[1] IBM Research Division, Thomas J Watson Research Center, Yorktown Heights
[2] IBM Technology Products, Essex Junction
关键词
D O I
10.1016/0167-9317(94)90009-4
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The use of integrated tools in semiconductor manufacturing has increased rapidly over the last few years. Increased clustering of process modules can make the sequential process steps more reliable. But the advent of clustering also made parallel processing possible. The combined effect is usually increased manufacturing productivity through lower cycle times and/or greater throughput. However, this difference in productivity can be difficult to quantify. Detailed simulation models of integrated tools provide a means to evaluate the various performance characteristics as a function of application specific process and equipment parameters.
引用
收藏
页码:139 / 146
页数:8
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