OVERVIEW OF MULTI-LEVEL METALLIZATION

被引：0
|
作者：
TOTTA, PA [1 ]
机构：
[1] IBM CORP,E FISHKILL,NY 12590
来源：
JOURNAL OF ELECTRONIC MATERIALS | 1988年 / 17卷 / 04期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：S10 / S10
页数：1
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