Line Length Effect on Electromigration Characteristics of Eutectic SnPb Solder

被引：1
|
作者：
Lee, Yong-Duk [1 ]
Lee, Jang-Hee [1 ]
Yoon, Min-Seung [2 ]
Joo, Young-Chang [2 ]
Park, Young-Bae [1 ]
机构：
[1] Andong Natl Univ, Sch Mat Sci & Engn, Andong 760749, South Korea
[2] Seoul Natl Univ, Sch Mat Sci & Engn, Seoul 151742, South Korea
来源：
KOREAN JOURNAL OF MATERIALS RESEARCH | 2007年 / 17卷 / 07期
关键词：
electromigration; eutectic SnPb; line length dependency; jL product;
D O I：
10.3740/MRSK.2007.17.7.371
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In-situ observation of electromigration behavior of eutectic SnPb solder was performed as a function of line length at 100(circle)C, 6x10(4)A/cm condition in a scanning electron microscope chamber. The incubation time for edge drift and the edge drift velocity increase as line length increases, which are discussed with the void nucleation stage of solder bump and the electromigration back flux force, respectively. Finally, the existence of electromigration product (jL) and its line length dependency are also discussed
引用
收藏
页码：371 / 375
页数：5
相关论文
共 11 条
  • [1] [Anonymous], 2005, INT TECHNOLOGY ROADM
  • [2] BLECH IA, 1976, J APPL PHYS, V47
  • [3] Electromigration behavior of eutectic SnPb solder
    Choi, JY
    Lee, SS
    Joo, YC
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2002, 41 (12): : 7487 - 7490
  • [4] Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization
    Choi, WJ
    Yeh, ECC
    Tu, KN
    [J]. JOURNAL OF APPLIED PHYSICS, 2003, 94 (09) : 5665 - 5671
  • [5] Interface diffusion in eutectic Pb-Sn solder
    Gupta, D
    Vieregge, K
    Gust, W
    [J]. ACTA MATERIALIA, 1998, 47 (01) : 5 - 12
  • [6] Kim B. N., 2006, MAT RES SOC S FALL M
  • [7] Kim O. H., 2005, J MICROELECTRONICS P, V12, P281
  • [8] Kim O. H., 2006, J MICROELECTRONICS P, V13, P7
  • [9] Electromigration of eutectic SnPb solder interconnects for flip chip technology
    Lee, TY
    Tu, KN
    Kuo, SM
    Frear, DR
    [J]. JOURNAL OF APPLIED PHYSICS, 2001, 89 (06) : 3189 - 3194
  • [10] Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization
    Lee, TY
    Tu, KN
    Frear, DR
    [J]. JOURNAL OF APPLIED PHYSICS, 2001, 90 (09) : 4502 - 4508
12