DIODES FOR HYBRID INTEGRATED-CIRCUITS

被引：0

作者：

LEPOFF, J ^{[1
]}

机构：

[1] HEWLETT PACKARD CO,HPA DIV,PALO ALTO,CA 94302

来源：

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：58 / 63

页数：6

共 50 条

[1] ACTIVE TRIMMING OF HYBRID INTEGRATED-CIRCUITS
NEMETH, P
KREMER, P
[J]. ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1984, 11 (03): : 231 - 235
[2] MICROWAVE HYBRID INTEGRATED-CIRCUITS - REPLY
DAVIES, R
NEWTON, BH
[J]. WIRELESS WORLD, 1978, 84 (1511): : 59 - 59
[3] NEW ALUMINA SUBSTRATE FOR HYBRID INTEGRATED-CIRCUITS
NIWA, K
NAKAMURA, J
MURAKAWA, K
NAKAMURA, M
[J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1974, PH10 (04): : 262 - 266
[4] ELECTROLESS NIP PROCESSING FOR HYBRID INTEGRATED-CIRCUITS
VANNIE, AG
[J]. MICROELECTRONICS AND RELIABILITY, 1976, 15 (03): : 221 - 226
[5] MICROWAVE INTEGRATED-CIRCUITS, FROM HYBRID TO MONOLITHIC
GIANNINI, F
[J]. ALTA FREQUENZA, 1988, 57 (09): : I225 - I231
[6] ZIRCONIUM BORIDE RESISTORS FOR HYBRID INTEGRATED-CIRCUITS
不详
[J]. MICROELECTRONICS AND RELIABILITY, 1975, 14 (01): : 67 - 67
[7] MOUNTING TECHNOLOGIES FOR HYBRID INTEGRATED-CIRCUITS AND THEIR MECHANIZATION
VANDERDRIFT, A
GRIFFITHS, GW
PETIT, R
[J]. ACTA ELECTRONICA, 1978, 21 (04): : 297 - 318
[8] PARASITIC INDUCTIVE INTERACTIONS IN HYBRID INTEGRATED-CIRCUITS
PUTILOV, BA
[J]. TELECOMMUNICATIONS AND RADIO ENGINEERING, 1986, 40-1 (05) : 96 - 98
[9] INTEGRATED-CIRCUITS
BURSKY, D
[J]. ELECTRONIC DESIGN, 1983, 31 (20) : 172 - &
[10] ASSESSMENT OF SILICONE ENCAPSULANTS FOR HYBRID INTEGRATED-CIRCUITS (HIC)
CHRISTOU, A
[J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1977, 13 (03): : 298 - 304