MILLIMETER-WAVE MODULES

被引：0
|
作者：
CACHIER, G
机构：
来源：
REVUE TECHNIQUE THOMSON-CSF | 1979年 / 11卷 / 04期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：785 / 822
页数：38
相关论文
共 50 条
  • [1] MILLIMETER-WAVE SOURCE MODULES
    ALBIN, RD
    HEWLETT-PACKARD JOURNAL, 1988, 39 (02): : 18 - 25
  • [2] MILLIMETER-WAVE PRETUNED MODULES
    CACHIER, G
    ESPAIGNOL, J
    STEVANCE, J
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1979, 27 (05) : 505 - 510
  • [3] Vertical feedthroughs for millimeter-wave LTCC modules
    Heyen, J
    Gordiyenko, A
    Heide, P
    Jacob, AF
    33RD EUROPEAN MICROWAVE CONFERENCE, VOLS 1-3, CONFERENCE PROCEEDINGS, 2003, : 411 - 414
  • [4] A family of millimeter-wave MMIC amplifiers and modules
    Itoh, Y
    1997 TOPICAL SYMPOSIUM ON MILLIMETER WAVES - PROCEEDINGS, 1998, : 15 - 18
  • [5] THE DESIGN OF SOURCE MODULES FOR A MILLIMETER-WAVE OPTICAL POWER COMBINER
    FRAYNE, PG
    POTTER, JM
    SIXTH INTERNATIONAL CONFERENCE ON ANTENNAS AND PROPAGATION ( ICAP 89 ), PARTS 1-2, 1989, 301 : A182 - A186
  • [6] High performance vertical interconnections for millimeter-wave multichip modules
    Kangasvieri, T.
    Komulainen, M.
    Jantunen, H.
    Vahakangas, J.
    35TH EUROPEAN MICROWAVE CONFERENCE, VOLS 1-3, CONFERENCE PROCEEDINGS, 2005, : 169 - 172
  • [7] Subminiature oscillator modules for millimeter-wave therapy and technology for their manufacturing
    Yatsunenko, A. G.
    Dzhevinsky, V. P.
    Vintman, Z. L.
    Pokataev, V. N.
    2006 16TH INTERNATIONAL CRIMEAN CONFERENCE MICROWAVE & TELECOMMUNICATION TECHNOLOGY, VOLS 1 AND 2, CONFERENCE PROCEEDINGS, 2006, : 921 - +
  • [8] Novel LTCC/BGA modules for highly integrated millimeter-wave transceivers
    Heyen, J
    von Kerssenbrock, T
    Chernyakov, A
    Heide, P
    Jacob, AF
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2003, 51 (12) : 2589 - 2596
  • [9] Millimeter-Wave Monolithic Integrated Circuits and Modules for Safety and Security Applications
    Schlechtweg, Michael
    Tessmann, Axel
    Huelsmann, Axel
    Kallfass, Ingmar
    Leuther, Arnulf
    Aidam, Rolf
    Zech, Christian
    Lewark, Ulrich J.
    Massler, Hermann
    Riessle, Markus
    Zink, Martin
    Rosenzweig, Josef
    Ambacher, Oliver
    FUTURE SECURITY, 2012, 318 : 200 - +
  • [10] Millimeter-wave characteristics of flip-chip interconnects for multichip modules
    Heinrich, Wolfgang
    Jentzsch, Andrea
    Baumann, Guido
    IEEE Transactions on Microwave Theory and Techniques, 1998, 46 (12 pt 2): : 2264 - 2268
12345