NOTE ON THE RHEOLOGICAL PROPERTIES OF ELASTO-PLASTIC MATERIALS

被引:2
|
作者
GOLDSMITH, K
机构
来源
BRITISH JOURNAL OF APPLIED PHYSICS | 1950年 / 1卷 / APR期
关键词
D O I
10.1088/0508-3443/1/4/305
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
收藏
页码:107 / 109
页数:3
相关论文
共 50 条
  • [1] Hardness of hardenable elasto-plastic materials
    Lankov, A.A.
    [J]. Trenie i Iznos, 1994, 15 (02): : 282 - 295
  • [2] The effect of elasto-plastic properties of materials on their formability by flow forming
    Bylya, Olga I.
    Khismatullin, Timur
    Blackwell, Paul
    Vasin, Rudolf A.
    [J]. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2018, 252 : 34 - 44
  • [3] MEASUREMENT OF THE ELASTO-PLASTIC PROPERTIES OF GELS
    GOLDSMITH, K
    [J]. NATURE, 1949, 163 (4146) : 601 - 601
  • [4] A Variational Model of Elasto-Plastic Behavior of Materials
    Pascale, Pietro
    Vemaganti, Kumar
    [J]. JOURNAL OF ELASTICITY, 2021, 147 (1-2) : 257 - 289
  • [5] FUNDAMENTAL PROPERTIES OF AN ELASTO-PLASTIC MATRIX AND THE EXISTENCE AND UNIQUENESS OF ELASTO-PLASTIC STRESS AND DISPLACEMENT.
    Cen Yanming
    [J]. Ku Ti Li Hsueh Hsueh Pao/Acta Mechanica Solida Sinica, 1987, (02): : 97 - 107
  • [6] Numerical Simulation of the Mechanical Properties and Failure of Heterogeneous Elasto-Plastic Materials
    陈永强
    孙树立
    刘奕
    [J]. Tsinghua Science and Technology, 2007, (05) : 527 - 532
  • [7] Numerical Simulation of the Mechanical Properties and Failure of Heterogeneous Elasto-Plastic Materials
    Chen, Yongqiang
    Sun, Shuli
    Liu, Yi
    [J]. Tsinghua Science and Technology, 2007, 12 (05) : 527 - 532
  • [8] Elasto-plastic constitutive modeling for granular materials
    彭芳乐
    李建中
    [J]. Journal of Central South University, 2004, (04) : 440 - 444
  • [9] A Variational Model of Elasto-Plastic Behavior of Materials
    Pietro Pascale
    Kumar Vemaganti
    [J]. Journal of Elasticity, 2021, 147 : 257 - 289
  • [10] Elasto-plastic constitutive modeling for granular materials
    Fang-le Peng
    Jian-zhong Li
    [J]. Journal of Central South University of Technology, 2004, 11 : 440 - 444